Sapphire Cutting & Drilling

We have extensive knowledge of various brittle materials processing, including sapphire.

Sapphire, being one of the hardest materials, is a widespread choice for companies working with reliable and lasting high-tech products.

We offer all the necessary processes for resistant and durable solutions:

  • sapphire cutting (coated or not coated material)
  • sapphire drilling of controlled taper hole
  • sapphire dicing
  • others upon request

Sapphire cutting
specifications

  • Irregular shape cutting (circular, square, other shapes)
  • High throughput and yield
  • Low chipping (typ. <20 μm)
  • Smooth sidewalls (Ra<1 μm)
  • High bending strength
  • Up to 200 mm x 200 mm (8”) wafer size
  • Up to 1 mm thick sapphire
  • No debris on back and the front surface
  • Ability to work with metalized and optically coated substrates
  • Mechanical sapphire cutting (Available)
  • Minimal or no post-processing is needed (smooth surface finish under request)

Sapphire drilling
specifications

  • Various hole shapes (circular, square, other shapes)
  • Controlled taper (positive, negative, zero taper)
  • Smooth drilled hole inner wall finish (Ra ≤ 200 nm)
  • Minimized stress area around drilled holes
  • Good bottom and sidewall quality of drilled wells
  • No melting and micro-cracks in peripheries
  • Precise control of hole depth
  • Up to 1:6 aspect ratio for Zero taper holes
  • High throughput and yield
  • Up to 200 mm x 200 mm (8”) wafer size
  • Up to 1 mm thick sapphire
  • Ability to work with metalized and optically coated substrates
  • Minimal or no post-processing is needed (smooth surface finish under request)
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Contact
information

WORKSHOP OF PHOTONICS
Mokslininku st. 6A, Vilnius, LT-08412, Lithuania

Phone: +370 5 215 7551
E-mail: [email protected]

Company details

Altechna R&D, UAB
Company code 301502628
VAT code LT100006155012
Bank – SEB 70440
LT87 7044 0600 0770 8092