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Laser Micro Cutting & Dicing

Laser Micro Cutting & Dicing

Glass cutting Thin films | Foil cutting Sapphire cutting

Glass Cutting

Ultrashort pulse laser cutting ensures ultra-high quality and precision on diverse materials – hard, fragile, soft, transparent, non-transparent, tempered, non-tempered, etc.

Here we are listing common applications for ultrashort pulse laser application, but if you have needs for not listed materials cutting, do not hesitate to discuss it with our team.

Glass Cutting

Laser cutting (scribing) process is optimized for each type of glass (tempered and non-tempered). The processing window is wide and can be easily set up according to various parameters.

Features:

Straight and round cut trajectories
Thickness of tempered glass from 0,3 mm to 1,3 mm
Thickness of non-tempered glass from 0,03 mm to 1 mm
DOL of tempered glass from 10 μm to 80 μm (depends on glass thickness)
Cutting speed from 200 mm/s
Cut surface roughness Ra<1 μm
Easy to break after processing
Smooth edges: minimal or no post-processing needed
No visible cracks or collateral damage near the cut line

Different processing parameters might be developed upon request.

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Thin films | Foils cutting

Laser cutting by cold ablation process is optimized for each material (plastic film, metal foil, others) that is used. Depending on customer needs we focus on minimal discoloration effects, cutting speed, or accuracy.

Features:

Straight and round cut trajectories
Minimal or no discoloration
Minimal or no signs of heat-affected deformations
Excellent cut surface quality, sub-micron precision of shape
High speed laser processing
Different processing parameters might be developed upon request.

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Plastic cutting

Sapphire cutting

Laser cutting (scribing) process is optimized for each type of sapphire that is used.
The processing window is wide and can be easily set up according to various parameters.

Features:

Straight and round cut trajectories
The thickness of sapphire from 100 μm to 760 μm
Cutting speed 200 mm/s or faster
Cut surface roughness Ra<1μm
Easy to break after processing
Smooth edges: minimal or no post-processing needed
No visible cracks or collateral damage near the cut line
Different processing parameters might be developed upon request.

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Contact
information

WORKSHOP OF PHOTONICS
Mokslininku st. 6A, Vilnius, LT-08412, Lithuania

Phone: +370 5 215 7551
E-mail: [email protected]

Company details

Altechna R&D, UAB
Company code 301502628
VAT code LT100006155012
Bank – SEB 70440
LT87 7044 0600 0770 8092