Laser Micro Cutting & Dicing

Glass Cutting

Laser cutting (scribing) process is optimized for each type of glass (tempered and non-tempered). The processing window is wide and can be easily set up according to various parameters.

Features:

• Straight and round cut trajectories
• Thickness of tempered glass from 0,3 mm to 1,3 mm
• Thickness of non-tempered glass from 0,03 mm to 1 mm
• DOL of tempered glass from 10 μm to 80 μm (depends on glass thickness)
• Cutting speed from 200 mm/s
• Cut surface roughness Ra<1 μm
• Easy to break after processing
• Smooth edges: minimal or no post-processing needed
• No visible cracks or collateral damage near the cut line

Different processing parameters might be developed upon request.

Sapphire cutting

Laser cutting (scribing) process is optimized for each type of sapphire that is used.
The processing window is wide and can be easily set up according to various parameters.

Features:

• Straight and round cut trajectories
• The thickness of sapphire from 100 μm to 760 μm
• Cutting speed 200 mm/s or faster
• Cut surface roughness Ra<1μm
• Easy to break after processing
• Smooth edges: minimal or no post-processing needed
• No visible cracks or collateral damage near the cut line
  Different processing parameters might be developed upon request.