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Laser Micro Cutting

Laser Micro Cutting & Dicing

Glass Cutting Polymer Cutting Sapphire Cutting Thin Films | Foil Cutting

Glass Cutting and Dicing

Ultrashort pulse laser cutting ensures ultra-high quality and precision on diverse materials – hard, fragile, soft, transparent, non-transparent, tempered, non-tempered, etc.

Here we are listing the most common applications – if you have needs for not listed materials cutting, do not hesitate to discuss it with our team.

Glass Cutting & Dicing

The glass laser cutting & dicing process is optimized for each type of glass (tempered and non-tempered).

WOP patented technology for cutting glass & sapphire offers ultra-high precision and quality tempered and non-tempered glass and sapphire laser cutting and dicing services.

Features:

Straight and circular cut trajectories
The thickness of tempered glass from 0,3 mm to 1,3 mm
The thickness of non-tempered glass from 0,03 mm to 1 mm
DOL of tempered glass from 10 μm to 80 μm (depends on glass thickness)
Cutting speed from 200 mm/s
Cut surface roughness Ra<1 μm
Easy to break after processing
Smooth edges: minimal or no post-processing needed
No visible cracks or collateral damage near the cut line

View all glass services femtoglass – glass cutting & dicing workstation

Polymer Micro Cutting

The Femtosecond lasers we use for polymers micromachining – polymer micro cutting and drilling – are unique due to minimized heat effects while keeping sub-micron feature size, providing superior quality and precision. It is a perfect choice when other lasers or mechanical polymer processing methods do not meet technical and quality requirements.

We work with thermoplastic polyesters, like polyethylene terephthalate (PET) and polybutylene terephthalate (PBT). Also, BICOR films, cyclo olefin copolymer (COC), diverse polyester films, and foils.

Features:

Polymers thickness from 8 to 250 µm
Straight and circular cut trajectories
Hole tolerance ~2 µm
Minimal or no discoloration
Minimal or no signs of heat-affected deformations
Excellent cut surface quality, sub-micron precision of shape
High-speed laser processing

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Polymer micro cutting

Microfluidic chips and devices manufacturing, plastic

Polymer micro cutting

Sapphire Cutting & Dicing

The sapphire laser cutting & dicing process is optimized for each type of sapphire used. We have extensive knowledge of processing for a variety of brittle materials, including sapphire and ruby.
The processing window is wide and quickly set up according to various parameters.

Features:

Straight and round cut trajectories
The thickness of sapphire from 100 μm to 760 μm
Cutting speed 200 mm/s or faster
Cut surface roughness Ra<1μm
Easy to break after processing
Smooth edges: minimal or no post-processing needed
No visible cracks or collateral damage near the cut line
Different processing parameters might be developed upon request.

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Thin Films | Foils Cutting

Laser cutting by cold ablation process is optimized for each material (plastic film, metal foil, others) that is used. Depending on customer needs we focus on minimal discoloration effects, cutting speed, or accuracy.

Features:

Straight and round cut trajectories
Minimal or no discoloration
Minimal or no signs of heat-affected deformations
Excellent cut surface quality, sub-micron precision of shape
High-speed laser processing
Different processing parameters might be developed upon request.

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Plastic cutting

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Contact
information

WORKSHOP OF PHOTONICS
Mokslininku st. 6A, Vilnius, LT-08412, Lithuania

Phone: +370 5 215 7551
E-mail: [email protected]

Company details

Altechna R&D, UAB
Company code 301502628
VAT code LT100006155012
Bank – SEB 70440
LT87 7044 0600 0770 8092