WOP offers ultra-high precision and quality glass laser drilling services. Prototyping and production services for your individual designs.
We use femtosecond laser radiation – a state-of-the-art technique showing many advantages over conventional laser processing, mechanical drilling, or lithography.
Glass wafers drilling: various mesh glass wafers and wafers for Wafer-level-packaging (WLP) can combine various shapes of through-holes with high aspect ratio channels in the same wafer.
We deliver high-surface quality glass wafers drilling with densely packed features that require no or minimum post-processing before being used in your production process.
With glass being a demanding material, we offer more than 10 years of experience in glass processing, including glass laser drilling, cutting, and dicing.
Rapid prototyping services to test your idea in an actual environment.
Ultra-high precision production services on all materials - glass, sapphire, ceramics, silicon, optical fibers, metal, plastic.
Tailor-made laser systems for industry & science. Designed for your specific applications.
Glass & sapphire cutting and dicing workstation for industry, that outperforms other glass cutting methods.
We offer price effective carrier wafers for convenient handling and release processes.
Customized glass multi-well plates designed to exact cell culture application. Multi-well plates can be used…
Unique laser technology for cutting glass & sapphire, developed by WOP. It stands out for…
WORKSHOP OF PHOTONICS
Mokslininku st. 6A, Vilnius, LT-08412, Lithuania
Phone: +370 5 215 7551
E-mail: [email protected]
Altechna R&D, UAB
Company code 301502628
VAT code LT100006155012
Bank – SEB 70440
LT87 7044 0600 0770 8092