Glass Micro Drilling

WOP offers ultra-high precision and quality glass laser micro-drilling services. Prototyping and production from 1 unit for your individual designs.

We use femtosecond laser radiation – a state-of-the-art technique showing many advantages over conventional laser processing, mechanical drilling, or lithography.

Various mesh glass wafers and wafers for Wafer-level-packaging (WLP) can combine various shapes of through-holes with high aspect ratio channels in the same wafer.

We deliver high surface quality glass wafers with densely packed features that require none or minimum post-processing before being used in your production process.

With glass being a demanding material, we offer more than 10 years of experience in glass processing, including drilling, cutting, and dicing.

We offer:

  • Ultra-high precision and quality
  • Various types of glasses
  • Small feature sizes
  • High aspect ratios unachievable with alternative technologies
  • Individual designs
Glass Micro Drilling, 3 mln. holes in 200 mm wafer
Glass Micro Drilling
Glass Carrier Wafer, 11.000 holes in 8 cm wafer
Glass Micro Drilling, 3 mln. holes in 200 mm wafer
Glass Micro Drilling
Glass Micro Drilling
Glass Carrier Wafer, 11.000 holes in 8 cm wafer

Typical features

  • Variety of glasses – Corning, Schott, Hoya, AGC
  • Wafer size – up to 200 mm x 200 mm (8”)
  • Wafer thickness – from 30 μm to 10 mm
  • Round, square and other shapes through holes
  • Straight hole cross-section | no taper
  • ≤10 μm chipping > typ. none
  • Smooth sidewalls, Ra<1 μm
  • Typical min. hole size 20 μm (round)
  • ±3 µm positional accuracy
  • No debris on back and front surface
  • No sagging around holes
  • Aspect ratio up to 1:100
  • High throughput and yield
  • Ability to work with metalized glasses (e.g. Au, Pt, Ni, Cr, Mo)
  • Minimal or no post-processing is needed

Gallery

Glass Micro Drilling
Glass Micro Drilling, 3 mln. holes in 200 mm wafer
Glass Micro Drilling, 3 mln. holes in 200 mm wafer
Glass Carrier Wafer, 11.000 holes in 8 cm wafer
Borosilicate Glass Micro Drilling
Glass Micro Drilling
Glass Micro Drilling, 3 mln. holes in 200 mm wafer
Glass Carrier Wafer, 11.000 holes in 8 cm wafer
Micro Drilled Glass
Glass Micro Drilling

Applications

  • Sensors
  • Advanced packaging applications
  • Semiconductors
  • MEMS
  • Wafer level optics
  • Aerospace applications

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Contact
information

WORKSHOP OF PHOTONICS
Mokslininku st. 6A, Vilnius, LT-08412, Lithuania

Phone: +370 5 215 7551
E-mail: [email protected]

Company details

Altechna R&D, UAB
Company code 301502628
VAT code LT100006155012
Bank – SEB 70440
LT87 7044 0600 0770 8092

Contacts

Mokslininku st. 6A,
Vilnius LT-08412, Lithuania.
Phone: +370 5 215 7551
E-mail: [email protected]

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All Rights Reserved.
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