Glass Micro Drilling

WOP offers ultra-high precision and quality glass laser micro drilling services: prototyping and production for your designs.

Using femtosecond laser radiation – a state-of-the-art technique – our glass drilling results show definite advantages over conventional laser processing, mechanical drilling, or lithography.

We provide a wide range of glass laser drilling services, from standard holes to complex arrays. Glass micro drilling applications include through holes, blind holes, and vertical or tapered sidewalls, depending on the required application. Hole diameters can vary from 20 µm with typically no chipping.

The demand for brittle material industrial use continues to grow, and WOP offers more than 10 years of experience in glass processing, including glass laser drilling, cutting, and dicing.

We offer:

  • Ultra-high precision and quality glass laser drilling
  • Various types of glasses
  • Small feature sizes
  • High aspect ratios unachievable with alternative technologies
  • Individual designs

Glass drilling range

While working with glass wafer drilling, various mesh glass wafers and wafers for Wafer-level-packaging (WLP) can combine different shapes of through-holes with high aspect ratio channels in the same wafer.

We deliver high-surface quality glass wafers drilling with densely packed features that require no or minimum post-processing before being used in your production process.

Besides glass wafer drilling, we provide a wide range of glass drilling services in parts for numerous applications: microfluidic chip channel drilling, guide plates for probe cards drilling, multiwell plates drilling, fiber alignment arrays drilling, glass needles drilling, and others.

Contact us to learn more

Glass micro drilling features

  • Variety of glasses – Corning, Schott, Hoya, AGC
  • Wafer size – up to 200 mm x 200 mm (8”)
  • Wafer thickness – from 30 μm to 10 mm
  • Round, square, and other shapes through holes
  • Straight hole cross-section | no taper
  • ≤10 μm chipping > typ. none
  • Smooth sidewalls, Ra<1 μm
  • Typical min. hole size 20 μm (round)
  • ±3 µm positional accuracy
  • No debris on the back and front surface
  • No sagging around the holes
  • Aspect ratio up to 1:100
  • High throughput and yield
  • Ability to work with metalized glasses (e.g. Au, Pt, Ni, Cr, Mo)
  • Minimal or no post-processing is needed


  • Sensors | MEMS
  • Biotech
  • Semiconductors
  • Optical communications
  • Wafer level optics
  • Aerospace applications
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Mokslininku st. 6A, Vilnius, LT-08412, Lithuania

Phone: +370 5 215 7551
E-mail: [email protected]

Company details

Altechna R&D, UAB
Company code 301502628
VAT code LT100006155012
Bank – SEB 70440
LT87 7044 0600 0770 8092