WOP offers ultra-high precision and quality glass laser micro-drilling services. Prototyping and production from 1 unit for your individual designs.
We use femtosecond laser radiation – a state-of-the-art technique showing many advantages over conventional laser processing, mechanical drilling, or lithography.
Various mesh glass wafers and wafers for Wafer-level-packaging (WLP) can combine various shapes of through-holes with high aspect ratio channels in the same wafer.
We deliver high surface quality glass wafers with densely packed features that require none or minimum post-processing before being used in your production process.
With glass being a demanding material, we offer more than 10 years of experience in glass processing, including drilling, cutting, and dicing.