WOP offers ultra-high precision and quality glass laser drilling services. Prototyping and production services for your individual designs.
We use femtosecond laser radiation – a state-of-the-art technique showing many advantages over conventional laser processing, mechanical drilling, or lithography.
Glass wafers drilling: various mesh glass wafers and wafers for Wafer-level-packaging (WLP) can combine various shapes of through-holes with high aspect ratio channels in the same wafer.
We deliver high-surface quality glass wafers drilling with densely packed features that require no or minimum post-processing before being used in your production process.
With glass being a demanding material, we offer more than 10 years of experience in glass processing, including glass laser drilling, cutting, and dicing.
Rapid prototyping services to test your idea in an actual environment.
Ultra-high precision production services on all materials - glass, sapphire, ceramics, silicon, optical fibers, metal, plastic.
Tailor-made laser systems for industry & science. Designed for your specific applications.