Glass laser micro drilling using femtosecond laser radiation is a state of the art technique showing many advantages over conventional laser processing, mechanical drilling, or lithography.
Various mesh glass wafers and wafers for Wafer-level-packaging (WLP) can combine various shapes of through-holes with high aspect ratio channels in the same wafer.
We offer high surface quality glass wafers with densely packed features that require none or minimum post-processing before being used in your production process.
Also, prototyping and production for your individual designs.
We offer:
- Ultra-high precision and quality
- Various types of glasses
- Small feature sizes
- High aspect ratios unachievable with alternative technologies
- Individual designs
