WOP offers ultra-high precision and quality glass laser micro-drilling services. Prototyping and production from 1 unit for your individual designs.
We use femtosecond laser radiation – a state-of-the-art technique showing many advantages over conventional laser processing, mechanical drilling, or lithography.
Various mesh glass wafers and wafers for Wafer-level-packaging (WLP) can combine various shapes of through-holes with high aspect ratio channels in the same wafer.
We deliver high surface quality glass wafers with densely packed features that require none or minimum post-processing before being used in your production process.
With glass being a demanding material, we offer more than 10 years of experience in glass processing, including drilling, cutting, and dicing.
Rapid prototyping services to test your idea in an actual environment.
Small to medium scale production services from 1 unit. All materials.
Tailor-made laser systems designed for your specific applications.