WOP offers ultra-high precision and quality glass laser micro drilling services: prototyping and production for your designs.
Using femtosecond laser radiation – a state-of-the-art technique – our glass drilling results show definite advantages over conventional laser processing, mechanical drilling, or lithography.
We provide a wide range of glass laser drilling services, from standard holes to complex arrays. Glass micro drilling applications include through holes, blind holes, and vertical or tapered sidewalls, depending on the required application. Hole diameters can vary from 20 µm with typically no chipping.
While working with glass wafer drilling, various mesh glass wafers and wafers for Wafer-level-packaging (WLP) can combine different shapes of through-holes with high aspect ratio channels in the same wafer.
We deliver high-surface quality glass wafers drilling with densely packed features that require no or minimum post-processing before being used in your production process.
Besides glass wafer drilling, we provide a wide range of glass drilling services in parts for numerous applications: microfluidic chip channel drilling, guide plates for probe cards drilling, multiwell plates drilling, fiber alignment arrays drilling, glass needles drilling, and others.
Rapid prototyping services to test your idea in an actual environment.
Ultra-high precision production services on all materials - glass, sapphire, ceramics, silicon, optical fibers, metal, plastic.
Tailor-made laser systems for industry & science. Designed for your specific applications.