For transparent materials, particularly in glass micromachining, WOP utilizes Selective Laser-Induced Etching (SLE). This process combines laser modification with chemical wet etching.
Selective Laser Etching (SLE) allows for the creation of complex 3D structures in various materials, providing high aspect ratios, micron-scale precision, and versatility. Additionally, it is cost-effective, as it eliminates the need for expensive masks or molding tools.
This technology is applicable in a range of fields, including microfluidic devices, microwells, fiber arrays, through glass via (TGV) wafers and panels, as well as other high-precision components in the biomedical, optical, and MEMS industries.
Features
- Various micro shapes – circular, square, irregular
- Hole diameter from 20 µm
- High aspect ratio – up to 1:100
- No micro cracks or chipping – SLE technology allows for avoidance of micro-cracks or chipping
- Smooth sidewalls – micro-holes have a roughness Ra <1 µm
- Straight hole cross-section – no taper
- Thin glass – from 30 µm to 3 mm
- Wafer size up to 200 mm x 200 mm (8’’)
- All glass types
