Selective Laser-Induced Etching (SLE)

For transparent materials like glass micromachining, WOP uses Selective Laser-induced Etching (SLE). This technology is suitable for micro parts (microfluidics, microwells), channels, and diverse cuts in transparent materials fabrication.

Our SLE technology allows us to reach exceptional properties on transparent materials.


  • Various micro shapes – circular, square, irregular
  • Hole diameter from 20 µm
  • High aspect ratio – up to 1:100
  • No micro cracks or chipping – SLE technology allows for avoidance of micro-cracks or chipping
  • Smooth sidewalls – micro-holes have a roughness Ra <1 µm
  • Straight hole cross-section – no taper
  • Thin glass – from 30 µm to 3 mm
  • Wafer size up to 200 mm x 200 mm (8’’)
  • All glass types
  • Hole diameter from 20 µm
  • High aspect ratio up to 1:100
  • Smooth sidewalls Ra<1 µm
  • No micro cracks or chipping
  • No taper
  • Thin glass & sapphire
    from 30 µm to 3 mm

Selective laser etching for 3D glass structures

Excellent accuracy and speed suitable for the industry

Selective laser etching (SLE) is a two-step process.

First, we modify glass by using ultra-short pulse laser radiation. Ultra-short pulses can effectively make modifications inside the transparent materials, and only one pulse is enough to go through the substrate. It ensures speed and quality for volume production.

Second, we remove the modified areas using wet chemical etching. Selective (SLE) means that modified areas are affected by etching much faster than unmodified ones, making it possible to achieve the desired result.

We have optimized the process achieving sufficient accuracy with speed suitable for the industry.


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Mokslininku st. 6A, Vilnius, LT-08412, Lithuania

Phone: +370 5 215 7551
E-mail: [email protected]

Company details

Altechna R&D, UAB
Company code 301502628
VAT code LT100006155012
Bank – SEB 70440
LT87 7044 0600 0770 8092