Selective Laser-Induced Etching (SLE)

For transparent materials like glass micromachining, WOP uses Selective Laser-induced Etching (SLE). This technology is suitable for micro parts (microfluidics, microwells), channels, and diverse cuts in transparent materials fabrication.

Our SLE technology allows us to reach exceptional properties on transparent materials.

Features

Various micro shapes – circular, square, irregular
Hole diameter from 20 µm
High aspect ratio – up to 1:100
No micro cracks or chipping – SLE technology allows for avoidance of micro-cracks or chipping
Smooth sidewalls – micro-holes have a roughness Ra <1 µm
Straight hole cross-section – no taper
Thin glass – from 30 µm to 3 mm
Wafer size up to 200 mm x 200 mm (8’’)
All glass types

Fiber alignment arrays, glass drilling with SLE

Glass rod for fiber optic collimators, ferrules, alignment fixture

Controlled taper selective laser etching (SLE) in fused silica glass

Glass wafer micro drilling with SLE

Glass micro drilling, no taper, with SLE

Selective laser etching for 3D glass structures

Glass wafer micro drilling with SLE

Glass microfabrication with SLE

Hole diameter from 20 µm
High aspect ratio up to 1:100
Smooth sidewalls Ra<1 µm
No micro cracks or chipping
No taper
Thin glass & sapphire

from 30 µm to 3 mm

Selective laser etching for 3D glass structures

Excellent accuracy and speed suitable for the industry

Selective laser etching (SLE) is a two-step process.

First, we modify glass by using ultra-short pulse laser radiation. Ultra-short pulses can effectively make modifications inside the transparent materials, and only one pulse is enough to go through the substrate. It ensures speed and quality for volume production.

Second, we remove the modified areas using wet chemical etching. Selective (SLE) means that modified areas are affected by etching much faster than unmodified ones, making it possible to achieve the desired result.

We have optimized the process achieving sufficient accuracy with speed suitable for the industry.