For transparent materials like glass micromachining, WOP uses Selective Laser-induced Etching (SLE). This technology is suitable for micro parts, channels, and diverse cuts in transparent materials fabrication.
Our used SLE technology allows us to reach exceptional properties on transparent materials.
Selective laser etching is a two-step process.
First, we modify glass by using ultra-short pulse laser radiation. Ultra-short pulses can effectively make modifications inside the transparent materials, and only one pulse is enough to go through the substrate. It ensures speed and quality for volume production.
Second, we remove the modified areas using wet chemical etching. Selective (SLE) means that modified areas are affected by etching much faster than unmodified ones, making it possible to achieve the desired result.
We have optimized the process achieving sufficient accuracy with speed suitable for the industry.
We offer price effective carrier wafers for convenient handling and release processes.
We offer ultra-high accuracy laser glass micro drilling. Highest quality in the market.
Suitable for 2.5D / 3D integration and wafer-level bonding with semiconductor substrates for MEMS, sensors,…
Ceramic plates and glass plates for the probe cards industry – an essential component for…
Rapid prototyping services to test your idea in an actual environment.
Ultra-high precision production services on all materials - glass, sapphire, ceramics, silicon, optical fibers, metal, plastic.
Tailor-made laser systems for industry & science. Designed for your specific applications.