Guide Plates for Probe Cards

WOP delivers Ceramic Plates and Glass Plates for the probe cards industry – an essential component for guiding probes for microchip inspection at the correct position.

We offer fast prototyping and production services from 1 unit for your individual designs.

The semiconductor industry further minimizing contact sizes and increasing density requires novel solutions to meet today’s market needs.

While conventional processing methods cannot keep up with feature size minimization at the same quality level, we offer industry-leading processing technology and experience.

We ensure:

  • Ultra-high precision & quality
  • Fast prototyping
  • Heat and force resistance
  • Small feature sizes
  • Diverse materials: ceramic (silicon carbide, silicon nitride) and many types of glasses
  • High aspect ratios unachievable with alternative technologies
  • Ultra-high precision
  • Fast prototyping
  • Heat and force resistance
  • All types of shapes
  • Small feature sizes
  • Diverse materials - ceramics, glass

Typical features

  • Circular, square, and other-shaped holes
  • Straight hole cross-section | no taper
  • Low chipping <10 μm
  • Smooth sidewalls, Ra <1 μm
  • Typical min. hole size 20 µm (circular)
  • Wafer size up to 200 mm x 200 mm (8”)
  • Wafer thickness from 30 µm to 10 mm
  • Positional accuracy ±3 µm
  • No debris on back and front surfaces
  • No sagging around holes
  • Aspect ratio up to 1:100
  • High throughput and yield
  • Ability to work with metalized glass types (e.g. Au, Pt, Ni, Cr, Mo)
  • Minimal or no post-processing is needed
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Contact
information

WORKSHOP OF PHOTONICS
Mokslininku st. 6A, Vilnius, LT-08412, Lithuania

Phone: +370 5 215 7551
E-mail: [email protected]

Company details

Altechna R&D, UAB
Company code 301502628
VAT code LT100006155012
Bank – SEB 70440
LT87 7044 0600 0770 8092