Our processing technique enables not only wafer-level but individual components from glass and quartz production.
High accuracy and mechanical strength glass components, products for Wafer-level-packaging (WLP) can all be done according to your individual design.
We offer price effective carrier wafers for convenient handling and release processes.
Ceramic plates and glass plates for the probe cards industry – an essential component for…
Glass & sapphire cutting workstation for industry, that outperforms other glass cutting methods.
We deliver fully integrated services. Use our expertise! From your task to prototyping and production….