Packaging Glass Products

Our processing technique enables not only wafer-level but individual components from glass and quartz production.

High accuracy and mechanical strength glass components, products for Wafer-level-packaging (WLP) can all be done according to your individual design.

We ensure:

  • Ultra-high precision and quality
  • Various types of glass
  • Small feature sizes
  • High aspect ratios unachievable with alternative technologies
Packaging Glass Products
Packaging Glass Products
Packaging Glass Products

Typical features

  • A variety of glass types and major suppliers – Corning, Schott, Hoya, AGC
  • Wafer size up to 200 mm x 200 mm (8”)
  • Wafer thickness from 30 µm to 10 mm
  • Circular, square, and other-shaped holes
  • Straight hole cross-section | no taper
  • Low chipping <10 μm, typ. none
  • Smooth sidewalls, Ra <1 μm
  • Typical min. hole size 20 µm (round)
  • Positional accuracy ±3 μm
  • No debris on back and front surfaces
  • No sagging around holes
  • Aspect ratio up to 1:100
  • High throughput and yield
  • Ability to work with metalized glass types (e.g. Au, Pt, Ni, Cr, Mo)
  • Minimal or no post-processing is needed

Applications

  • Sensors
  • Advanced packaging applications
  • Semiconductors
    and other functional devices
  • MEMS
  • Wafer level optics
  • Aerospace applications
Packaging Glass Products
Packaging Glass Products
Packaging Glass Products

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Contact
information

WORKSHOP OF PHOTONICS
Mokslininku st. 6A, Vilnius, LT-08412, Lithuania

Phone: +370 5 215 7551
E-mail: [email protected]

Company details

Altechna R&D, UAB
Company code 301502628
VAT code LT100006155012
Bank – SEB 70440
LT87 7044 0600 0770 8092

Contacts

Mokslininku st. 6A,
Vilnius LT-08412, Lithuania.
Phone: +370 5 215 7551
E-mail: [email protected]

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All Rights Reserved.
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