Our processing technique enables not only wafer-level but individual components from glass and quartz production.
High accuracy and mechanical strength glass components, products for Wafer-level-packaging (WLP) can all be done according to your custom design.
We offer fast prototyping and production services from 1 unit.
We offer price effective carrier wafers for convenient handling and release processes.
Ceramic plates and glass plates for the probe cards industry – an essential component for…
Glass & sapphire cutting workstation for industry, that outperforms other glass cutting methods.
Rapid prototyping services. A solution for your micron-scale tasks.