Packaging Glass Products

Typical features

• A variety of glass types and major suppliers – Corning, Schott, Hoya, AGC
• Wafer size up to 200 mm x 200 mm (8”)
• Wafer thickness from 30 µm to 10 mm
• Circular, square, and other-shaped holes
• Straight hole cross-section | no taper
• Low chipping <10 μm, typ. none
• Smooth sidewalls, Ra <1 μm
• Typical min. hole size 20 µm (round)
• Positional accuracy ±3 μm
• No debris on back and front surfaces
• No sagging around holes
• Aspect ratio up to 1:100
• High throughput and yield
• Ability to work with metalized glass types (e.g. Au, Pt, Ni, Cr, Mo)
• Minimal or no post-processing is needed

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