Glass spacers | Interposers

Our produced Glass Spacers (Interposers) are suitable for 2.5D / 3D integration and wafer-level bonding with semiconductor substrates for MEMS, sensors, analytical chips, or other functional devices.

WOP offers high surface quality glass wafers densely packed through holes that require none or minimum post-processing before being used in your production process.

We offer fast prototyping and production from 1 unit for your individual designs.

We ensure:

  • Ultra-high precision and quality
  • Various types of glass
  • Small feature sizes
  • High aspect ratios unachievable with alternative technologies


  • Custom design
    we will make any design you want
  • Speed
    1 million holes in 15 minutes, takt time
  • Ultra-high precision & quality
  • Various types of glasses
  • Small feature sizes
  • High aspect ratios

Typical features

  • A variety of glass types and major suppliers – Corning, Schott, Hoya, AGC
  • Wafer size up to 200 mm x 200 mm (8”)
  • Wafer thickness from 30 µm to 10 mm
  • Circular, square, and other-shaped holes
  • Straight hole cross-section | no taper
  • Low chipping <10 μm, typ. none
  • Smooth sidewalls, Ra <1 μm
  • Typical min. hole size 20 µm (round)
  • Positional accuracy ±3 μm
  • No debris on back and front surfaces
  • No sagging around holes
  • Aspect ratio up to 1:100
  • High throughput and yield
  • Ability to work with metalized glass types (e.g. Au, Pt, Ni, Cr, Mo)


  • Sensors
  • Advanced packaging applications
  • Semiconductors
    and other functional devices
  • MEMS
  • Wafer level optics
  • Aerospace applications
Contact us

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Mokslininku st. 6A, Vilnius, LT-08412, Lithuania

Phone: +370 5 215 7551
E-mail: [email protected]

Company details

Altechna R&D, UAB
Company code 301502628
VAT code LT100006155012
Bank – SEB 70440
LT87 7044 0600 0770 8092