Our produced Glass Spacers (Interposers) are suitable for 2.5D / 3D integration and wafer-level bonding with semiconductor substrates for MEMS, sensors, analytical chips, or other functional devices.
We ensure:
- Ultra-high precision and quality
- Various types of glasses
- Small feature sizes
- High aspect ratios unachievable with alternative technologies
WOP offers high surface quality glass wafers with densely packed through holes that require none or minimum post-processing before being used in your production process. We offer prototyping and production for your individual designs.
