Our produced Glass Spacers (Interposers) are suitable for 2.5D / 3D integration and wafer-level bonding with semiconductor substrates for MEMS, sensors, analytical chips, or other functional devices.
WOP offers high surface quality glass wafers densely packed through holes that require none or minimum post-processing before being used in your production process. We offer prototyping and production for your individual designs.
Ceramic plates and glass plates for the probe cards industry – an essential component for…
Glass & sapphire cutting workstation for industry, that outperforms other glass cutting methods.
We deliver fully integrated services. Use our expertise! From your task to prototyping and production….
Our processing technique enables not only wafer-level but individual components from glass and quartz production….