Our produced Glass Spacers (Interposers) are suitable for 2.5D / 3D integration and wafer-level bonding with semiconductor substrates for MEMS, sensors, analytical chips, or other functional devices.
WOP offers high surface quality glass wafers densely packed through holes that require none or minimum post-processing before being used in your production process.
We offer fast prototyping and production from 1 unit for your individual designs.
Ceramic plates and glass plates for the probe cards industry – an essential component for…
Glass & sapphire cutting workstation for industry, that outperforms other glass cutting methods.
Rapid prototyping services. A solution for your micron-scale tasks.
Our processing technique enables not only wafer-level but individual components from glass and quartz production….