We deliver ultra-high precision silicon laser drilling services.
Silicon is the most widely used material in numerous fields – semiconductors, electronic devices, computer chips, solar cells, diverse alloys, etc.
Silicon processing methods, applying our unique femtosecond laser capabilities, enable us to offer market-leading services.
We are confident in offering hole diameters from a few micrometers to tens of millimeters at highly competitive prices.
Rapid prototyping services to test your idea in an actual environment.
Small to medium scale production services from 1 unit. All materials.
Tailor-made laser systems designed for your specific applications.
Ceramic plates and glass plates for the probe cards industry – an essential component for…
High processing speed Ultra-high accuracy Minimal heat-affected zone Various shapes holes No melting or micro-cracks…
We offer ultra-high precision laser glass micro drilling. Highest quality in the market.
Glass & sapphire cutting and dicing workstation for industry, that outperforms other glass cutting methods.