Silicon Drilling

We deliver ultra-high precision silicon laser drilling services.

Silicon is the most widely used material in numerous fields – semiconductors, electronic devices, computer chips, solar cells, diverse alloys, etc.

Silicon processing methods, applying our unique femtosecond laser capabilities, enable us to offer market-leading services.

We are confident in offering hole diameters from a few micrometers to tens of millimeters at highly competitive prices.


  • Ultra-high precision
  • No cracking of the material
  • Accurate taper control – positive, negative, or zero taper
  • High aspect ratio
  • Possibility of drilling blind and through holes


  • High processing speed
  • Ultra-high precision
  • Various shapes holes
    Circular, square, irregular
  • Minimal heat-affected zone (HAZ)
  • No melting or micro-cracks

Technical specifications


  • Various shapes holes drilling
  • Controlled taper (positive, negative, zero taper)
  • Smooth inner wall finish (≤ Ra 200 nm)
  • Minimized stress area around drilled holes
  • Low chipping <20 μm (typ. none)
  • Up to 1:8 aspect ratio for Zero taper holes
  • High throughput and yield
  • No melting and micro-cracks in peripheries
  • Precise control of hole depth
  • Up to 200×200 mm (8”) substrate size
  • Up to 1 mm thickness substrates
  • Minimal or no post-processing is needed
Contact us

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Mokslininku st. 6A, Vilnius, LT-08412, Lithuania

Phone: +370 5 215 7551
E-mail: [email protected]

Company details

Altechna R&D, UAB
Company code 301502628
VAT code LT100006155012
Bank – SEB 70440
LT87 7044 0600 0770 8092