Glass Laser Cutting & Dicing

WOP patented technology for cutting glass & sapphire offers ultra-high precision and quality tempered and non-tempered glass and sapphire laser cutting and dicing services.

Our technology ensures ultra-high precision and quality for all glass grades, including chemically tempered or optically coated glasses.

There are plenty of areas where our glass-cutting method is applicable in industries such as semiconductors, microfluidics, and micro-optics.

One of the most common applications is glass wafer dicing – our results demonstrate exceptional performance for chipping and edge quality.

Other possible applications are custom thin glass cutting, coverslips and microscopy slides, cover glass cutting, mobile phone screens, buttons, camera lens cutting, smart glasses screens cutting, etc.

We ensure:

  • Ultra-high quality and precision cutting on tempered and non-tempered glass
  • Small feature sizes
  • Thin glass cutting and dicing >> from 30 µm to 3 mm
  • Various shapes cutting – circular, square, irregular
  • High aspect ratios, unachievable with alternative technologies
  • Glass wafer dicing
  • Thin glass cutting & dicing
  • Mobile phones screens cutting
  • Microscopy slides cutting
  • Smart glasses screens cutting

Over 10 years of expertise in glass - exceptional quality results

  • High throughput and yield
  • Straight or irregular cuts
  • <20 μm chipping (typ. none)
  • Smooth side walls (Ra<1 μm)
  • Ability to cut from 30 µm to 10 mm thick glass
  • No debris on the back and the front surface
  • High bending strength (up to 180 MPa)
  • Easy adaptation for different glass types (Borofloat 33, Eagle XG, D263T, SD2, SW-Y, Gorilla, AS87, etc.) or fused silica
  • Ability to cut non-glass materials (Available)
  • Mechanical glass cutting (Available)
  • Ability to work with metalized and optically coated glasses
  • Minimal or no post-processing is needed

Glass cutting & dicing laser system FemtoGLASS

Laser workstation FemtoGLASS for glass cutting and dicing

While we deliver glass cutting and dicing services, you may decide to own a laser workstation for your application and organize production in your facilities.

In that case, we offer a glass cutting & dicing laser system, FemtoGLASS – we will develop and install this at your site.

Our glass & sapphire laser cutting workstation is based on patented WOP glass & sapphire cutting technology, which is unique for ultra-high precision and quality results.

Understanding market needs and the growing demand for glass as a material, we have developed a unique state-of-the-art glass and sapphire cutting & dicing technology to overcome today’s market challenges.

Check our FemtoGLASS
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Mokslininku st. 6A, Vilnius, LT-08412, Lithuania

Phone: +370 5 215 7551
E-mail: [email protected]

Company details

Altechna R&D, UAB
Company code 301502628
VAT code LT100006155012
Bank – SEB 70440
LT87 7044 0600 0770 8092