Glass Laser Cutting & Dicing

WOP’s patented technology for cutting glass & sapphire offers ultra-high precision and quality tempered and non-tempered glass and sapphire laser cutting and dicing services.

Our technology ensures ultra-high precision and quality for all specialty glass grades, including chemically tempered or optically coated glasses.

There are plenty of areas where our laser glass-cutting method is applicable in industries such as semiconductors, microfluidics, and micro-optics.

One of the most common applications is glass wafer dicing – our results demonstrate exceptional chipping and edge-quality performance.

Other possible applications are laser thin glass cutting, coverslips, microscopy slides, cover glass cutting, mobile phone screens, buttons, camera lens cutting, smart glasses screens cutting, etc.

We ensure:

  • Ultra-high quality and precision laser cutting on tempered and non-tempered glass
  • Small feature sizes
  • Thin glass laser cutting and dicing >> from 30 µm to 3 mm
  • Various shapes cutting – circular, square, irregular
  • High aspect ratios, unachievable with alternative technologies

Applicable for industrial applications

  • Wafer level glass product dicing
  • Thin glass
    cutting & dicing
  • Mobile phones screens, camera lenses cutting
  • Microoptics elements cutting
  • Augmented reality, smart glasses screens cutting
  • Display technologies cutting

Over 10 years of expertise in glass laser processing

With glass being a demanding material, we offer more than 10 years of experience in glass processing, including glass drilling, cutting, and dicing. Intensive research in glass machining and unique glass processing techniques ensure ultra-high precision & exceptional quality results.

  • High throughput and yield
  • Straight or irregular cuts
  • <20 μm chipping (typ. none)
  • Smooth side walls (Ra<1 μm)
  • Ability to cut from 30 µm to 10 mm thick glass
  • No debris on the back and the front surface
  • High bending strength (up to 180 MPa)
  • Easy adaptation for different glass types (Borofloat 33, Eagle XG, D263T, SD2, SW-Y, Gorilla, AS87, etc.) or fused silica
  • Ability to cut non-glass materials (Available)
  • Mechanical glass cutting (Available)
  • Ability to work with metalized and optically coated glasses
  • Minimal or no post-processing is needed

Glass cutting & dicing laser system FemtoGLASS

Laser workstation FemtoGLASS for glass cutting and dicing

While we deliver glass laser cutting and dicing services, you may decide to own a laser workstation for your application and organize production in your facilities.

In that case, we offer a glass cutting & dicing laser system, FemtoGLASS, ideal for research & development, and volume manufacturing. We will develop a laser system according to your application, and install it at your site.

Our glass & sapphire laser cutting workstation is based on patented WOP glass & sapphire cutting technology, which is unique for ultra-high precision and quality results.

Understanding market needs and the growing demand for glass as a material, we have developed a unique state-of-the-art glass and sapphire cutting & dicing technology to overcome today’s market challenges.

Check our FemtoGLASS
Contact us

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Mokslininku st. 6A, Vilnius, LT-08412, Lithuania

Phone: +370 5 215 7551
E-mail: [email protected]

Company details

Altechna R&D, UAB
Company code 301502628
VAT code LT100006155012
Bank – SEB 70440
LT87 7044 0600 0770 8092