Laser Technology For cutting glass & sapphire

Unique laser technology for cutting glass & sapphire, developed by WOP. It stands out for ultra-high precision and quality.

Main features

• Variety of materials – tempered, non-tempered glass, and sapphire.
• Irregular shape cutting.
• High process speed ≥ 200 mm/s.
• Low chipping < 20 µm for most materials.
• Easy breaking for non-tempered glass and self-breaking for tempered glass.
• Smooth sidewalls after breaking, Ra < 1 µm.
• Tested with high DOL glass from 0,4 mm to 1,3 mm thickness.
• DOL layer from 10 µm to > 40 µm.
• High bending strength.