Laser Technology For cutting glass & sapphire

Unique laser technology for cutting glass & sapphire, developed by WOP. It stands out for ultra-high precision and quality.

Main features

Variety of materials – tempered, non-tempered glass, and sapphire.
Irregular shape cutting.
High process speed ≥ 200 mm/s.
Low chipping < 20 µm for most materials.
Easy breaking for non-tempered glass and self-breaking for tempered glass.
Smooth sidewalls after breaking, Ra < 1 µm.
Tested with high DOL glass from 0,4 mm to 1,3 mm thickness.
DOL layer from 10 µm to > 40 µm.
High bending strength.

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Technology for cutting glass and sapphire

Video for glass processing services

For the glass becoming a demanding material, Workshop of Photonics has developed a unique state of the art glass and sapphire cutting technology to overcome challenges arising from new materials and customers’ requirements.

It offers ultra-high precision and quality on tempered, non-tempered glasses and sapphire, small feature sizes, and high aspect ratios unachievable with alternative technologies.

Benefits

Variety of materials

tempered, non-tempered glass and sapphire
Tested
thickness

30 µm to 1,3 mm
Irregular
shape

cutting
High process
speed

≥ 200 mm/s
Low
chipping

< 20 µm for most materials
Smooth
side walls

after breaking, Ra < 1 µm

Solutions for system integrators

Optimized for 1028-1064 nm wavelength (515-532 on request).
Sealed monolithic housing.
Integrated monitored linear axis with 15 mm travel (eliminates external Z axis need).
Optional external Machine vision unit.
Optional alignment module for adjustment.
Packages include an optical module and a technology license.
Dimensions HxWxD: 395x240x95 mm.