Laser Technology For cutting glass & sapphire

Unique laser technology for cutting glass & sapphire, developed by WOP. It stands out for ultra-high precision and quality.

Main features

  • Variety of materials – tempered, non-tempered glass, and sapphire.
  • Irregular shape cutting.
  • High process speed ≥ 200 mm/s.
  • Low chipping < 20 µm for most materials.
  • Easy breaking for non-tempered glass and self-breaking for tempered glass.
  • Smooth sidewalls after breaking, Ra < 1 µm.
  • Tested with high DOL glass from 0,4 mm to 1,3 mm thickness.
  • DOL layer from 10 µm to > 40 µm.
  • High bending strength.

Video for glass processing services

For the glass becoming a demanding material, Workshop of Photonics has developed a unique state of the art glass and sapphire cutting technology to overcome challenges arising from new materials and customers’ requirements.

It offers ultra-high precision and quality on tempered, non-tempered glasses and sapphire, small feature sizes, and high aspect ratios unachievable with alternative technologies.


  • Variety of materials
    tempered, non-tempered glass and sapphire
  • Tested
    30 µm to 1,3 mm
  • Irregular
  • High process
    ≥ 200 mm/s
  • Low
    < 20 µm for most materials
  • Smooth
    side walls
    after breaking, Ra < 1 µm

Solutions for system integrators

  • Optimized for 1028-1064 nm wavelength (515-532 on request).
  • Sealed monolithic housing.
  • Integrated monitored linear axis with 15 mm travel (eliminates external Z axis need).
  • Optional external Machine vision unit.
  • Optional alignment module for adjustment.
  • Packages include an optical module and a technology license.
  • Dimensions HxWxD: 395x240x95 mm.

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Mokslininku st. 6A, Vilnius, LT-08412, Lithuania

Phone: +370 5 215 7551
E-mail: [email protected]

Company details

Altechna R&D, UAB
Company code 301502628
VAT code LT100006155012
Bank – SEB 70440
LT87 7044 0600 0770 8092