Laser Micro Drilling

Silicon Drilling

Silicon processing methods, applying our unique femtosecond laser capabilities, enable us to offer market-leading services.

Silicon is the most widely used material in numerous fields – semiconductors, electronic devices, computer chips, solar cells, diverse alloys, etc.

Features

• Ultra-high precision
• No cracking of the material
• Accurate taper control – positive, negative, or zero taper
• High aspect ratio
• Possibility of drilling blind and through holes

Optical Fibers Drilling

Laser drilling of optical fibers using femtosecond laser radiation is a state-of-the-art technique showing many advantages over conventional laser processing, and mechanical drilling that enable precise process control.

Advantages – high processing speed, lower costs, and higher accuracy.

Features:

• No melting and micro-cracks in peripheries
• Hole diameter as small as 10 μm
• Precise control of taper angle and depth
• Variable geometry of holes

Different processing parameters might be developed upon request.

Polymer Micro Drilling

The Femtosecond lasers we use for polymers micromachining – polymer micro cutting and drilling – are unique due to minimized heat effects while keeping sub-micron feature size, providing superior quality and precision. It is a perfect choice when other lasers or mechanical polymer processing methods do not meet technical and quality requirements.

We work with thermoplastic polyesters, like polyethylene terephthalate (PET) and polybutylene terephthalate (PBT). Also, BICOR films, cyclo olefin copolymer (COC), diverse polyester films, and foils.

Features:

• Polymers thickness from 8 to 250 µm
• Straight and circular cut trajectories
• Hole tolerance ~2 µm
• Minimal or no discoloration
• Minimal or no signs of heat-affected deformations
• Excellent cut surface quality, sub-micron precision of shape
• High-speed laser processing