Our ability to densely pack tens and hundreds of thousands of through holes in glass wafers allows us to offer price-effective carrier wafers for convenient handling and release processes.
We offer fast prototyping and production services from 1 unit.
Depending on your needs we offer alkali and alkali-free perforated re-usable glass carriers which are custom made according to your design.
A straight cross-section of the hole enables us to combine more holes than are possible with other technologies and combine large through-holes with narrow channels at the same time.
Suitable for 2.5D / 3D integration and wafer-level bonding with semiconductor substrates for MEMS, sensors,…
Glass & sapphire cutting workstation for industry, that outperforms other glass cutting methods.
Unique laser technology for cutting glass & sapphire, developed by WOP. It stands out for…
Fast prototyping services. A solution for your micron-scale tasks.