We offer ultra-high precision & quality services for all types of materials.
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We ensure ultra-high precision and quality on tempered and non-tempered glasses, small feature sizes, and high ...
We offer high surface quality glass wafers with densely packed features that require none or ...
High processing speed
Ultra-high accuracy
Minimal heat-affected zone
Irregular shape holes
No melting or micro-cracks
We use a unique processing technique enabling no cracks in hole peripheries, accurate taper control, ...
High accuracy, straight and round cuts, smooth edges, no cracks. The process is optimized for each ...
Precise process control, high processing speed, lower costs, and higher accuracy.
Our fiber processing expertise allows us to produce specially designed shaped tip fibers. We manage ...
Cutting
Polishing
Grinding
Size reduction
Thickness reduction
Laser cutting by cold ablation process is optimized for each material (plastic film, metal foil, ...
We use a unique processing technique enabling no cracks in hole peripheries, accurate taper control, ...
We offer price effective carrier wafers for convenient handling and release processes.
Suitable for 2.5D / 3D integration and wafer-level bonding with semiconductor substrates for MEMS, sensors, ...
Our processing technique enables not only wafer-level but individual components from glass and quartz production.
Ceramic plates and glass plates for the probe cards industry – an essential component for ...
We deliver fully integrated services. Use our expertise! From your task to prototyping and production. ...
Our facilities are equipped to handle any femtosecond laser micromachining task.
