Our produced Through Glass Via (TGV) wafers are suitable for the metallization of microholes.
We produce TGV microholes wafers of custom size and design, eligible for any metalization process you use.
WOP offers high surface quality TGV glass wafers densely packed through holes that require none or minimum post-processing before being used in your production process.
We offer fast prototyping and production from 1 unit for your individual designs.
Ceramic plates and glass plates for the probe cards industry – an essential component for…
Our processing technique enables not only wafer-level but individual components from glass and quartz production….
Suitable for 2.5D / 3D integration and wafer-level bonding with semiconductor substrates for MEMS, sensors,…
Glass & sapphire cutting workstation for industry, that outperforms other glass cutting methods.