Through Glass Via Wafer | TGV

Our produced Through Glass Via (TGV) wafers are suitable for the metallization of microholes.

We produce TGV microholes wafers of custom size and design, eligible for any metalization process you use.

WOP offers high surface quality TGV glass wafers densely packed through holes that require none or minimum post-processing before being used in your production process.

We offer fast prototyping and production from 1 unit for your individual designs.

Features:

  • Glass Thickness: <1.1 mm
  • Wafer sizes: all standard up to 200 mm
  • Minimum microhole diameter: 10 µm
  • Positional accuracy: +-3 µm
  • No chipping
  • Hole type: Through Via (True circle or Ellipse), Blind Via (True circle or Ellipse)
  • Hole shape: hourglass
  • Option: singulation from hole-processed large-sized glass

Benefits

  • Custom design
    we will make any design you want
  • Speed
    1 million holes in 15 minutes, takt time
  • Ultra-high precision & quality
  • Various types of glasses
  • Small feature sizes
  • High aspect ratios

Typical features

  • Glass Thickness: <1.1 mm
  • Wafer sizes: all standard up to 200 mm
  • Minimum microhole diameter: 10 µm
  • Positional accuracy: +-3 µm
  • No chipping
  • Hole type: Through Via (True circle or Ellipse), Blind Via (True circle or Ellipse)
  • Hole shape: hourglass
  • Option: singulation from hole-processed large-sized glass.

Applications

  • Sensors
  • Advanced packaging applications
  • Semiconductors
    and other functional devices
  • MEMS
  • Wafer level optics
  • Aerospace applications
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Contact
information

WORKSHOP OF PHOTONICS
Mokslininku st. 6A, Vilnius, LT-08412, Lithuania

Phone: +370 5 215 7551
E-mail: [email protected]

Company details

Altechna R&D, UAB
Company code 301502628
VAT code LT100006155012
Bank – SEB 70440
LT87 7044 0600 0770 8092