Our produced Through Glass Via (TGV) wafers are suitable for the metallization of microholes.
We produce TGV microholes wafers of custom size and design, eligible for any metalization process you use.
WOP offers high surface quality TGV glass wafers densely packed through holes that require none or minimum post-processing before being used in your production process.
We offer rapid prototyping and production services for your individual designs.
Rapid prototyping services to test your idea in an actual environment.
Ultra-high precision production services on all materials - glass, sapphire, ceramics, silicon, optical fibers, metal, plastic.
Tailor-made laser systems for industry & science. Designed for your specific applications.
Ceramic plates and glass plates for the probe cards industry – an essential component for…
Our processing technique enables not only wafer-level but individual components from glass and quartz production….
Suitable for 2.5D / 3D integration and wafer-level bonding with semiconductor substrates for MEMS, sensors,…
Glass & sapphire cutting and dicing workstation for industry, that outperforms other glass cutting methods.