Through Glass Via Wafers | TGVs

Our produced Through Glass Via (TGV) wafers are suitable for the metallization of microholes.

We produce TGV microholes wafers of custom size and design, eligible for any metalization process you use.

WOP offers high surface quality TGV glass wafers densely packed through holes that require none or minimum post-processing before being used in your production process.

We offer prototyping and contract manufacturing services for your individual designs. Also, laser system development for TGV micromachining.

WOP TGVs parameters:

  • Roundness: >95%
  • Waist: Borosilicate >90%, Alkali-free >75% (with deviation of ±3%)
  • Diameter tolerance: ± 3%
  • Accuracy: ±1 µ m (<5 µm per 515×510 mm panel)
  • Roughness: Rz <1 µm
  • Yield: 100%
  • Taper: taperless, hourglass

Benefits

  • Various types of glass
    BF33, D263T, EXG, SG 7.8, SG 3.4, EN-1A, OA-11
  • Min micro hole dia
    10 µm single-shot | 40 µm multi-shot
  • Hole shape
    hourglass or taperless
  • Speed
    up to 5000 holes / sec, single shot
  • High aspect ratios
    up to 1:100
  • Custom designs

WOP advancements in TGV

WOP’s journey with TGV began in 2017, and over the years, we have accumulated fundamental knowledge through extensive experimentation.

As a result of this long-term expertise in glass micromachining, WOP is now able to offer the highest quality vias in the market today, featuring a 100% yield and repeatability.

WOP advancements in Through Glass Via, TGV

WOP current state of the art in TGVs

While both multi-shot and single-shot methods can be employed, each has its advantages.

Multi-shot methods provide better control and facilitate the creation of high aspect ratio TGVs, while single-shot methods are significantly faster but may face limitations in other specifications.

SINGLE SHOT
MULTI SHOT
Glass type BF33, D263T, EXG, SG 7.8, SG 3.4, EN-1A, OA-11 BF33, D263T, EXG, SG 7.8, SG 3.4, EN-1A, OA-11
Glass thickness* up to 1,1 mm 0,1 – 10 mm
Min micro hole diameter* 10 µm 40 µm
Aspect ratio* up to 1:100 up to 1:100
Hole shape hourglass or taperless hourglass or taperless
Processing speed up to 5000 holes/sec
depends on panel design
20 holes/sec

* depending on glass type

FemtoTGV laser system

FemtoTGV is a laser micromachining workstation optimized for Through Glass Vias (TGV) fabrication.

The most used method for glass core substrate processing while creating TGVs is laser fabrication, combined with a wet etch process. Our FemtoTGV is dedicated for laser fabrication part.

WOP has been dedicated to mastering the laser micromachining of glass substrates for over a decade.

And has developed process technologies and equipment that are suitable for high aspect ratio through glass vias across a variety of glass types, diverse via configurations (including hourglass, straight, and tapered vias), and different etching capabilities by utilizing various chemistries.

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FemtoTGV laser system

Progress in precise Through Glass Via (TGV) developments

As high-performance semiconductors advance, packaging has become crucial – especially the interposer, which connects multiple dies within a package.

While silicon has traditionally been used, glass is emerging as a promising alternative due to several key advantages:

  • Electrical Performance. Glass offers superior insulation, a lower dielectric constant, and minimal leakage current, reducing signal loss and crosstalk at high data rates—ideal for AI and HPC applications.
  • Surface Quality. Its ultra-smooth and uniform surface allows for precise, dense routing with tight pitch, supporting advanced packaging needs.
  • Scalability. Unlike silicon, glass can be processed on large panels, enabling larger and more cost-effective interposers for packages with bigger die footprints and more HBM stacks.
  • Thermal Compatibility. Glass’s coefficient of thermal expansion closely matches silicon, improving mechanical reliability during temperature changes.

selective laser etching process
Selective laser etching | SLE

The most immediate demand is for glass interposers, which face intense bandwidth, signal quality, and size requirements. As a result, glass interposer development is advancing more rapidly than glass core substrates, although both areas are being actively explored.

Laser technology for TGV

The most used method for glass core substrate processing while creating TGVs is laser fabrication, combined with a wet etch process. Once the TGVs are fabricated, they are filled with copper to provide electrical connections between the front and back of the glass panel substrate.

Regardless of the glass fabrication process is known, there are still many challenges to address, such as the hole size, roundness, X/Y location, sidewall profile, defective vias, fabrication speed, and other factors that are critical to package performance and cost. The level of expertise and knowledge in glass micromachining is crucial in overcoming these challenges.

WOP has been dedicated to mastering the laser micromachining of glass substrates for over a decade and has developed process technologies and equipment that are suitable for high aspect ratio through glass vias across a variety of glass types, diverse via configurations (including hourglass, straight, and tapered vias), and different etching capabilities by utilizing various chemistries.

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Applications

  • Sensors
  • Advanced packaging applications
  • Semiconductors
    and other functional devices
  • MEMS
  • Wafer level optics
  • Aerospace applications
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Contact
information

WORKSHOP OF PHOTONICS
Mokslininku st. 6A, Vilnius, LT-08412, Lithuania

Phone: +370 5 215 7551
E-mail: [email protected]

Company details

Altechna R&D, UAB
Company code 301502628
VAT code LT100006155012
Bank – SEB 70440
LT87 7044 0600 0770 8092