WOP’s journey with TGV began in 2017, and over the years, we have accumulated fundamental knowledge through extensive experimentation.
As a result of this long-term expertise in glass micromachining, WOP is now able to offer the highest quality vias in the market today, featuring a 100% yield and repeatability.
While both multi-shot and single-shot methods can be employed, each has its advantages.
Multi-shot methods provide better control and facilitate the creation of high aspect ratio TGVs, while single-shot methods are significantly faster but may face limitations in other specifications.
SINGLE SHOT |
MULTI SHOT |
|
| Glass type | BF33, D263T, EXG, SG 7.8, SG 3.4, EN-1A, OA-11 | BF33, D263T, EXG, SG 7.8, SG 3.4, EN-1A, OA-11 |
| Glass thickness* | up to 1,1 mm | 0,1 – 10 mm |
| Min micro hole diameter* | 10 µm | 40 µm |
| Aspect ratio* | up to 1:100 | up to 1:100 |
| Hole shape | hourglass or taperless | hourglass or taperless |
| Processing speed | up to 5000 holes/sec depends on panel design |
20 holes/sec |
* depending on glass type
FemtoTGV is a laser micromachining workstation optimized for Through Glass Vias (TGV) fabrication.
The most used method for glass core substrate processing while creating TGVs is laser fabrication, combined with a wet etch process. Our FemtoTGV is dedicated for laser fabrication part.
WOP has been dedicated to mastering the laser micromachining of glass substrates for over a decade.
And has developed process technologies and equipment that are suitable for high aspect ratio through glass vias across a variety of glass types, diverse via configurations (including hourglass, straight, and tapered vias), and different etching capabilities by utilizing various chemistries.
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As high-performance semiconductors advance, packaging has become crucial – especially the interposer, which connects multiple dies within a package.
While silicon has traditionally been used, glass is emerging as a promising alternative due to several key advantages:
Selective laser etching | SLE
The most used method for glass core substrate processing while creating TGVs is laser fabrication, combined with a wet etch process. Once the TGVs are fabricated, they are filled with copper to provide electrical connections between the front and back of the glass panel substrate.
Regardless of the glass fabrication process is known, there are still many challenges to address, such as the hole size, roundness, X/Y location, sidewall profile, defective vias, fabrication speed, and other factors that are critical to package performance and cost. The level of expertise and knowledge in glass micromachining is crucial in overcoming these challenges.
WOP has been dedicated to mastering the laser micromachining of glass substrates for over a decade and has developed process technologies and equipment that are suitable for high aspect ratio through glass vias across a variety of glass types, diverse via configurations (including hourglass, straight, and tapered vias), and different etching capabilities by utilizing various chemistries.
Rapid prototyping services to test your idea in an actual environment.
Ultra-high precision production services on all materials - glass, sapphire, ceramics, silicon, optical fibers, metal, plastic.
Tailor-made laser systems for industry & science. Designed for your specific applications.
Laser micromachining workstation optimized for Through Glass Vias (TGV) fabrication.
Suitable for 2.5D / 3D integration and wafer-level bonding with semiconductor substrates for MEMS, sensors,…
Our processing technique enables not only wafer-level but individual components from glass and quartz production….
Glass & sapphire cutting and dicing workstation for industry, that outperforms other glass cutting methods.
WORKSHOP OF PHOTONICS
Mokslininku st. 6A, Vilnius, LT-08412, Lithuania
Phone: +370 5 215 7551
E-mail: [email protected]
Altechna R&D, UAB
Company code 301502628
VAT code LT100006155012
Bank – SEB 70440
LT87 7044 0600 0770 8092
