Through Glass Via Wafer | TGV

Our produced Through Glass Via (TGV) wafers are suitable for the metallization of microholes.

We produce TGV microholes wafers of custom size and design, eligible for any metalization process you use.

WOP offers high surface quality TGV glass wafers densely packed through holes that require none or minimum post-processing before being used in your production process.

We offer rapid prototyping and production services for your individual designs.

Features:

• Glass Thickness: <1.1 mm
• Wafer sizes: all standard up to 200 mm
• Minimum microhole diameter: 10 µm
• 99% identical diameter holes
• Positional accuracy: +-3 µm
• No chipping
• Super smooth sidewalls: RA < 0,08 µm
• Hole type: Through Via (True circle or Ellipse), Blind Via (True circle or Ellipse)
• Hole shape: hourglass
• Option: singulation from hole-processed large-sized glass