| Parameter | Value |
|---|---|
| Glass compatibility | BF33, D263t, EXG, SG 7.8 , SG 3.4, EN-1A, OA-11 |
| Laser | High power ultrashort pulse IR |
| Optical beam delivery | WOP patented optical beam delivery engine |
| Samples size | Laboratory: up to 300×300 mm Industrial: up to 600×600 mm |
| Positioning system | XYZ mechanical axes, positioning accuracy ±0.5 μm featuring continuous wafer level patterning |
| Vision | Real-time visualization and positioning camera with feature recognition |
| Metrology | Compactable with AOI |
| Sample handling | Manual | semi automatic | automatic |
| Optical pulse detection function | Miss fire detection or Low energy detection |
| Fume extraction system | Included |
| Accessories | Power control, polarization state control |
| Software | Entire system control via single GUI developed by WOP |
| Supported file formats | – 2D/3D model import: STL, DXF, DWG, AMF, PLT, FAB – Bitmap support: BMP, GIF, JPG, JPEG, PNG – Text files as a table array: TXT, RTF, TEX |
| Construction | Granite base with passive / active vibration control |
WOP’s journey with TGV began in 2017, and over the years, we have accumulated fundamental knowledge through extensive experimentation.
As a result of this long-term expertise in glass micromachining, WOP is now able to offer the highest quality vias in the market today, featuring a 100% yield and repeatability.
While both multi-shot and single-shot methods can be employed, each has its advantages.
Multi-shot methods provide better control and facilitate the creation of high aspect ratio TGVs, while single-shot methods are significantly faster but may face limitations in other specifications.
SINGLE SHOT |
MULTI SHOT |
|
| Glass type | BF33, D263T, EXG, SG 7.8, SG 3.4, EN-1A, OA-11 | BF33, D263T, EXG, SG 7.8, SG 3.4, EN-1A, OA-11 |
| Glass thickness* | up to 1,1 mm | 0,1 – 10 mm |
| Min micro hole diameter* | 10 µm | 40 µm |
| Aspect ratio* | up to 1:100 | up to 1:100 |
| Hole shape | hourglass or taperless | hourglass or taperless |
| Processing speed | up to 5000 holes/sec depends on panel design |
20 holes/sec |
*depending on glass type
The most immediate demand is for glass interposers, which face intense bandwidth, signal quality, and size requirements. As a result, glass interposer development is advancing more rapidly than glass core substrates, although both areas are being actively explored.
As high-performance semiconductors advance, packaging has become crucial – especially the interposer, which connects multiple dies within a package.
While silicon has traditionally been used, glass is emerging as a promising alternative due to several key advantages:
Rapid prototyping services to test your idea in an actual environment.
Ultra-high precision production services on all materials - glass, sapphire, ceramics, silicon, optical fibers, metal, plastic.
Tailor-made laser systems for industry & science. Designed for your specific applications.
Glass wafers for TGV production. Microholes for your specification. Suitable for the metallization process.
For transparent materials like glass micromachining, WOP uses Selective Laser-induced Etching (SLE). This technology is…
Suitable for 2.5D / 3D integration and wafer-level bonding with semiconductor substrates for MEMS, sensors,…
We offer price effective carrier wafers for convenient handling and release processes.
WORKSHOP OF PHOTONICS
Mokslininku st. 6A, Vilnius, LT-08412, Lithuania
Phone: +370 5 215 7551
E-mail: [email protected]
Altechna R&D, UAB
Company code 301502628
VAT code LT100006155012
Bank – SEB 70440
LT87 7044 0600 0770 8092
