FemtoGLASS Glass cutting and dicing workstation for industry

The FemtoGLASS is a new glass & sapphire laser cutting and dicing workstation ideal for research & development, and volume manufacturing.

It is based on patented WOP glass & sapphire cutting technology, which is unique for ultra-high quality and precision results.

Understanding market needs and the growing demand for glass as a material, we have developed a unique state-of-the-art glass and sapphire cutting & dicing technology to overcome today’s market challenges.

Our technology outperforms other glass-cutting methods and thus is very well applicable in semiconductors, microfluidics, and micro-optics industries.

Features

Ultra-thin (30 µm to 2 mm in a single pass) glass & sapphire cutting
High process speed – up to 800 mm/s
All shapes: circular, square, irregular
Tunable dicing process for different substrate thicknesses
Inner and outer contours
Easy breaking for non-tempered glass and self-breaking for tempered glass

Why is it better?
Cutting examples

FemtoGLASS glass cutting and dicing laser system

FemtoGLASS glass cutting laser system

Glass Cutting and Dicing

D236T glass laser cutting, thickness 300 µm

Sapphire laser cutting, thickness 700 µm

D236T glass laser cutting, thickness 300 µm

Features

High speed

up to 800 mm/s
Ultra thin glass

& sapphire: 30 μm to 10 mm
All glass types

Tempered, non-tempered, sapphire
All shapes

Circular, square, irregular
Low chipping

<10 μm
Tunable dicing process

for different substrate thicknesses

Applications

FemtoGLASS main applications are glass wafer dicing, custom thin glass cutting, mobile phone screens, buttons, camera lens cutting, smart glasses screens cutting, micro-optics, etc.

It offers ultra-high quality and precision on tempered glass, non-tempered glass & sapphire, small feature sizes, and high aspect ratios unachievable with alternative technologies.

Quality of cut

Cut width less than 1 μm
Low chipping <10 μm
No post-processing required

Contact us to learn more

Our glass cutting technology used for

Wafer level glass product dicing

Mobile phone sapphire screens cutting

Mobile phones camera lenses cutting

Mobile phones sapphire buttons cutting

Augmented reality, smart glasses screens

Microoptics elements

Glass | Sapphire Cutting and Dicing

WOP Glass cutting workstation OUTPERFORMS other glass cutting methods:

	Blade	Stealth laser	Laser ablation	WOP FemtoGLASS
Glass thickness	2 – 19 mm	200 µm – 10 mm	30 µm – 2 mm	30 µm – 2 mm in a single pass
Glass type	All types	Non-tempered Sapphire	All types	Tempered Non-tempered Sapphire
Cutting speed	up to 100 mm/s	Up to 300 mm/s	Up to 10 mm/s	Up to 800 mm/s
Possible shapes	Straight cuts only	T-shapes and circular shapes are possible	Any shape	Any shape possible
Surface chipping	< 200 µm	< 50 µm	< 50 µm	< 10 µm
Street requirement	> 50 µm	< 15 µm	> 50 µm	< 1 µm
Water (cooling/cleaning)	yes	no	yes	no
Debris	yes	no	yes	no
Thermal effect on the device	yes	no	yes	no