FemtoGLASS main applications are glass wafer dicing, custom thin glass cutting, coverslips and microscopy slides, cover glass cutting, mobile phone screens, buttons, camera lens cutting, smart glasses screens cutting, etc.
It offers ultra-high quality and precision on tempered glass, non-tempered glass & sapphire, small feature sizes, and high aspect ratios unachievable with alternative technologies.
Blade dicing |
Stealth laser dicing |
WOP laser dicing |
|
| Glass thickness | 2 – 19 mm | 200 µm – 10 mm | 30 µm – 3 mm |
| Glass type | All types | Non-tempered Sapphire |
Tempered Non-tempered Sapphire |
| Cutting speed | up to 100 mm/s | Up to 300 mm/s | Up to 1000 mm/s |
| Possible shapes | Straight cuts only | T-shapes and circular shapes are possible | Any shape possible |
| Surface chipping | < 200 µm | < 50 µm | < 10 µm |
Rapid prototyping services to test your idea in an actual environment.
Ultra-high precision production services on all materials - glass, sapphire, ceramics, silicon, optical fibers, metal, plastic.
Tailor-made laser systems for industry & science. Designed for your specific applications.
WORKSHOP OF PHOTONICS
Mokslininku st. 6A, Vilnius, LT-08412, Lithuania
Phone: +370 5 215 7551
E-mail: [email protected]
Altechna R&D, UAB
Company code 301502628
VAT code LT100006155012
Bank – SEB 70440
LT87 7044 0600 0770 8092
