The FemtoGLASS is a new glass & sapphire laser cutting and dicing workstation ideal for research & development, and volume manufacturing.
It is based on patented WOP glass & sapphire cutting technology, which is unique for ultra-high quality and precision results.
Understanding market needs and the growing demand for glass as a material, we have developed a unique state-of-the-art glass and sapphire cutting & dicing technology to overcome today’s market challenges.
Our technology outperforms other glass-cutting methods and thus is very well applicable in semiconductors, microfluidics, and micro-optics industries.
FemtoGLASS main applications are glass wafer dicing, custom thin glass cutting, coverslips and microscopy slides, cover glass cutting, mobile phone screens, buttons, camera lens cutting, smart glasses screens cutting, etc.
It offers ultra-high quality and precision on tempered glass, non-tempered glass & sapphire, small feature sizes, and high aspect ratios unachievable with alternative technologies.
Stealth laser dicing
WOP laser dicing
|Glass thickness||2 – 19 mm||200 µm – 10 mm||30 µm – 3 mm|
|Glass type||All types||Non-tempered
|Cutting speed||up to 100 mm/s||Up to 300 mm/s||Up to 1000 mm/s|
|Possible shapes||Straight cuts only||T-shapes and circular shapes are possible||Any shape possible|
|Surface chipping||< 200 µm||< 50 µm||< 10 µm|
Rapid prototyping services to test your idea in an actual environment.
Ultra-high precision production services on all materials - glass, sapphire, ceramics, silicon, optical fibers, metal, plastic.
Tailor-made laser systems for industry & science. Designed for your specific applications.