FemtoGLASS Glass cutting and dicing workstation for industry

The FemtoGLASS is a new glass & sapphire laser cutting and dicing workstation ideal for research & development, and volume manufacturing.

It is based on patented WOP glass & sapphire cutting technology, which is unique for ultra-high quality and precision results.

Understanding market needs and the growing demand for glass as a material, we have developed a unique state-of-the-art glass and sapphire cutting & dicing technology to overcome today’s market challenges.

Our technology outperforms other glass-cutting methods and thus is very well applicable in semiconductors, microfluidics, and micro-optics industries.


  • Ultra-fast thin (30 µm to 3 mm) glass & sapphire cutting
  • High process speed – up to 1000 mm/s
  • Various shapes cutting – circular, square, irregular
  • Inner and outer contours
  • Easy breaking for non-tempered glass and self-breaking for tempered glass


FemtoGLASS main applications are glass wafer dicing, custom thin glass cutting, coverslips and microscopy slides, cover glass cutting, mobile phone screens, buttons, camera lens cutting, smart glasses screens cutting, etc.

It offers ultra-high quality and precision on tempered glass, non-tempered glass & sapphire, small feature sizes, and high aspect ratios unachievable with alternative technologies.

Quality of cut

  • Cut width less than 1 μm
  • Low chipping <10 μm
  • No post-processing required


  • High speed
    up to 1000 mm/s
  • Ultra thin
    glass & sapphire: 30 μm to 3 mm
  • Various glass
    Tempered, non-tempered, sapphire
  • Irregular shapes
  • Low chipping
    <10 μm
  • Inner and outer contours

WOP Glass cutting workstation OUTPERFORMS other glass cutting methods:

Blade dicing
Stealth laser dicing
WOP laser dicing
Glass thickness 2 – 19 mm 200 µm – 10 mm 30 µm – 3 mm
Glass type All types Non-tempered
Cutting speed up to 100 mm/s Up to 300 mm/s Up to 1000 mm/s
Possible shapes Straight cuts only T-shapes and circular shapes are possible Any shape possible
Surface chipping < 200 µm < 50 µm < 10 µm

We deliver a full-service solution

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Mokslininku st. 6A, Vilnius, LT-08412, Lithuania

Phone: +370 5 215 7551
E-mail: [email protected]

Company details

Altechna R&D, UAB
Company code 301502628
VAT code LT100006155012
Bank – SEB 70440
LT87 7044 0600 0770 8092