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Sapphire Cutting

Sapphire Cutting

We offer high-accuracy sapphire cutting services – straight and round cuts, smooth edges, no cracks.

We have extensive knowledge of processing for a variety of brittle materials, including sapphire and ruby.

As one of the hardest materials, sapphire is a widespread choice for companies that work with reliable and durable high-tech products.

Our laser cutting (scribing) process is optimized for all types of sapphire.

Advantages

High accuracy
Irregular shape cuts
Smooth edges, no cracks

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Sapphire cutting 0.1 mm thickness. Side view

0.6 mm sapphire cutting

Sapphire cutting 0.325 mm thickness. Top view

Glass | Sapphire Cutting and Dicing

High accuracy
Irregular shape cuts
No cracks
Smooth edges
Minimal or no post-processing

Features

Irregular shape cutting (circular, square, other shapes)
High throughput and yield
Low chipping (typ. <20 μm)
Smooth sidewalls (Ra<1 μm)
High bending strength
Up to 200 mm x 200 mm (8”) wafer size

Up to 1 mm thick sapphire
No debris on the back and the front surface
Ability to work with metalized and optically coated substrates
Mechanical sapphire cutting (Available)
Minimal or no post-processing is needed (smooth surface finish under request)

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Application examples

0.6 mm sapphire cutting

Sapphire cutting 0.325 mm thickness. Top view

Sapphire cutting 0.1 mm thickness. Side view

Glass | Sapphire Cutting and Dicing

We deliver a full-service solution

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Contact
information

WORKSHOP OF PHOTONICS
Mokslininku st. 6A, Vilnius, LT-08412, Lithuania

Phone: +370 5 215 7551
E-mail: [email protected]

Company details

Altechna R&D, UAB
Company code 301502628
VAT code LT100006155012
Bank – SEB 70440
LT87 7044 0600 0770 8092