Sapphire Cutting

We have extensive knowledge of various brittle materials processing, including sapphire.

Sapphire, being one of the hardest materials, is a widespread choice for companies working with reliable and lasting high-tech products.

Laser cutting (scribing) process is optimized for all types of sapphire.

Advantages

  • High accuracy
  • Irregular shape cuts
  • Smooth edges, no cracks
  • High accuracy
  • Irregular shape cuts
  • No cracks
  • Smooth edges
  • Minimal or no post-processing

Features

  • Irregular shape cutting (circular, square, other shapes)
  • High throughput and yield
  • Low chipping (typ. <20 μm)
  • Smooth sidewalls (Ra<1 μm)
  • High bending strength
  • Up to 200 mm x 200 mm (8”) wafer size
  • Up to 1 mm thick sapphire
  • No debris on the back and the front surface
  • Ability to work with metalized and optically coated substrates
  • Mechanical sapphire cutting (Available)
  • Minimal or no post-processing is needed (smooth surface finish under request)
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Contact
information

WORKSHOP OF PHOTONICS
Mokslininku st. 6A, Vilnius, LT-08412, Lithuania

Phone: +370 5 215 7551
E-mail: [email protected]

Company details

Altechna R&D, UAB
Company code 301502628
VAT code LT100006155012
Bank – SEB 70440
LT87 7044 0600 0770 8092