Glass wafers and panels for TGV production. Microholes for your specification. Suitable for the metallization…
1D, 2D arrays, designed to reach ultra-precise alignment and positioning, enabling high-speed data transmission with…
Ceramic plates and glass plates for the probe cards industry – an essential component for…
We ensure ultra-high precision and quality tempered and non-tempered glass laser cutting and dicing –…
Suitable for 2.5D / 3D integration and wafer-level bonding with semiconductor substrates for MEMS, sensors,…
Laser micromachining workstation optimized for Through Glass Vias (TGV) fabrication.
We offer price effective carrier wafers for convenient handling and release processes.
Our processing technique enables not only wafer-level but individual components from glass and quartz production….
High processing speed Ultra-high accuracy Minimal heat-affected zone Various shapes holes No melting or micro-cracks…
High processing speed Ultra-high accuracy Minimal heat-affected zone Various shapes holes No melting or micro-cracks…
Laser drilling of metal alloys brings high quality and precision for many applications – filters,…
We offer high-quality laser micro-cutting and drilling services for various polymers and engineering plastics.
We offer ultra-high precision laser glass micro drilling. Highest quality in the market.
Glass & sapphire cutting and dicing workstation for industry, that outperforms other glass cutting methods.
Rapid prototyping services. A solution for your micron-scale tasks.
We provide ultra-high precision laser micromachining services. All materials, fast prototyping.