Ceramic plates and glass plates for the probe cards industry – an essential component for…
Glass wafers for TGV production. Microholes for your specification. Suitable for the metallization process.
Suitable for 2.5D / 3D integration and wafer-level bonding with semiconductor substrates for MEMS, sensors,…
We offer price effective carrier wafers for convenient handling and release processes.
Our processing technique enables not only wafer-level but individual components from glass and quartz production….
High processing speed Ultra-high accuracy Minimal heat-affected zone Various shapes holes No melting or micro-cracks…
High processing speed Ultra-high accuracy Minimal heat-affected zone Various shapes holes No melting or micro-cracks…
Laser drilling of metal alloys brings high quality and precision for many applications – filters,…
We offer high-quality laser micro-cutting and drilling services for various polymers and engineering plastics.
We ensure ultra-high precision and quality tempered and non-tempered glass laser cutting and dicing –…
We offer ultra-high precision laser glass micro drilling. Highest quality in the market.
Glass & sapphire cutting and dicing workstation for industry, that outperforms other glass cutting methods.
Rapid prototyping services. A solution for your micron-scale tasks.
We provide ultra-high precision laser micromachining services. All materials, fast prototyping.
