Ruby Drilling

Ruby laser drilling, using femtosecond laser radiation, is a unique processing technique enabling no cracks in hole peripheries, accurate taper control, and smooth wall finish.

Advantages

Ultra-high accuracy
Reliable process control
Minimal or no post-processing is needed

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Ruby drilling bottom view

Ruby drilling top view

Ultra-high accuracy
Reliable process control
No cracks in hole peripheries
Accurate taper control
Smooth wall finish
Minimal or no post-processing

Features

Various hole shapes (circular, square, other shapes)
Controlled taper (positive, negative, zero taper)
Smooth drilled hole inner wall finish (Ra ≤ 200 nm)
Minimized stress area around drilled holes
Good bottom and sidewall quality of drilled wells
No melting and micro-cracks in peripheries
Precise control of hole depth

Up to 1:6 aspect ratio for Zero taper holes
High throughput and yield
Up to 200 mm x 200 mm (8”) wafer size
Up to 1 mm thick sapphire
Ability to work with metalized and optically coated substrates
Minimal or no post-processing is needed (smooth surface finish under request)

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Application examples

Ruby drilling top view

Ruby drilling bottom view

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Contact
information

WORKSHOP OF PHOTONICS
Mokslininku st. 6A, Vilnius, LT-08412, Lithuania

Phone: +370 5 215 7551
E-mail: [email protected]

Company details

Altechna R&D, UAB
Company code 301502628
VAT code LT100006155012
Bank – SEB 70440
LT87 7044 0600 0770 8092