Sapphire Drilling

Sapphire laser drilling, using femtosecond laser radiation, is a unique processing technique enabling no cracks in hole peripheries, accurate taper control, and smooth wall finish.

We continue the development of sapphire drilling techniques to meet our customers’ needs.

Advantages

  • Ultra-high accuracy
  • Reliable process control
  • Minimal or no post-processing is needed
  • Ultra-high accuracy
  • Reliable process control
  • No cracks in hole peripheries
  • Accurate taper control
  • Smooth wall finish
  • Minimal or no post-processing

Features

  • Various hole shapes (circular, square, other shapes)
  • Controlled taper (positive, negative, zero taper)
  • Smooth drilled hole inner wall finish (Ra ≤ 200 nm)
  • Minimized stress area around drilled holes
  • Good bottom and sidewall quality of drilled wells
  • No melting and micro-cracks in peripheries
  • Precise control of hole depth
  • Up to 1:6 aspect ratio for Zero taper holes
  • High throughput and yield
  • Up to 200 mm x 200 mm (8”) wafer size
  • Up to 1 mm thick sapphire
  • Ability to work with metalized and optically coated substrates
  • Minimal or no post-processing is needed (smooth surface finish under request)
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Contact
information

WORKSHOP OF PHOTONICS
Mokslininku st. 6A, Vilnius, LT-08412, Lithuania

Phone: +370 5 215 7551
E-mail: [email protected]

Company details

Altechna R&D, UAB
Company code 301502628
VAT code LT100006155012
Bank – SEB 70440
LT87 7044 0600 0770 8092