WOP Transparent Material Cutting Module

Unique laser technology for industrial glass, sapphire, and other brittle materials cutting, developed by WOP | Workshop of Photonics.

Based on WOP patented technology, it stands out for ultra-high precision and quality results, outperforming other glass cutting and dicing methods.

The module is easy to integrate – however, minimum quantities apply.

Key features

  • High process speed up to 800 mm/s
  • Ultra-thin (30 μm to 3 mm) glass & sapphire cutting
  • Tempered, non-tempered glass, sapphire, and other brittle materials cutting
  • Irregular shapes
  • Inner and outer contours
  • Easy breaking for non-tempered and self-breaking for tempered glass.
  • High bending strength
  • Low chipping < 10 µm
  • Smooth sidewalls after breaking, Ra < 1 µm
Transparent material cutting module
Integrated transparent material cutting module
Glass Cutting and Dicing
D236T glass laser cutting, thickness 300 µm
Sapphire laser cutting, thickness 700 µm

Transparent materials cutting examples

Glass Cutting and Dicing
D236T glass laser cutting, thickness 300 µm
Sapphire laser cutting, thickness 400 µm
Sapphire laser cutting, thickness 400 µm
Sapphire laser cutting, thickness 700 µm
Sapphire laser cutting, thickness 400 µm
Fused silica glass laser cutting, thickness 250 µm
D236T glass laser cutting, thickness 300 µm
D236T glass laser cutting, thickness 300 µm
Glass | Sapphire Cutting and Dicing
D236T glass laser cutting, thickness 300 µm

D236T glass laser cutting, thickness 300 µm

Perfect cuts

The demand for brittle materials industrial use continues to grow, raising new challenges and requirements for precision laser dicing. Addressing market needs Workshop of Photonics (WOP) developed a unique state-of-the-art glass and sapphire dicing technology to increase process yield and efficiency.

It offers ultra-high precision and quality on tempered glass, non-tempered glass, sapphire, and other brittle materials. Also small feature sizes, and high aspect ratios unachievable with alternative technologies.

Module advantages:

  • Compatible with various femtosecond lasers
  • Outperforms other glass-cutting methods
  • Patented technology
  • Easy to integrate
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Cutting module benefits

  • Variety of materials
    tempered, non-tempered glass, sapphire, other brittle materials
  • Tested
    thickness
    30 µm to 3 mm
  • Irregular
    shape
    cutting
  • High process
    speed
    up to 800 mm/s
  • Low
    chipping
    < 10 µm for most materials
  • Smooth
    side walls
    after breaking, Ra < 1 µm

Glass cutting applications examples

Mobile phone sapphire screens cutting
Mobile phones sapphire buttons cutting
Mobile phones camera lenses cutting
Augmented reality, smart glasses screens
Microoptics elements
Wafer level glass product dicing

WOP Glass cutting workstation OUTPERFORMS other glass cutting methods:

Blade
Stealth laser
Laser ablation
WOP Module
Glass thickness 2 – 19 mm 200 µm – 10 mm 30 µm – 2 mm 30 µm – 3 mm
Glass type All types Non-tempered
Sapphire		 All types Tempered
Non-tempered
Sapphire
Cutting speed up to 100 mm/s Up to 300 mm/s Up to 10 mm/s Up to 800 mm/s
Possible shapes Straight cuts only T-shapes and circular shapes are possible Any shape Any shape possible
Surface chipping < 200 µm < 50 µm < 50 µm < 10 µm
Street requirement > 50 µm < 15 µm > 50 µm < 1 µm
Water (cooling/cleaning) yes no yes no
Debris yes no yes no
Thermal effect on the device yes no yes no

Glass cutting module specifications:

  • Optimized for 1028-1064 nm wavelength (515-532 on request)
  • Sealed monolithic housing
  • Optional external Machine vision unit
  • Optional alignment module for adjustment
  • Packages include an optical module and a technology license
  • Dimensions HxWxD: 266x140x95 mm
Integrated transparent material cutting module

Integrated transparent material cutting module

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Applications

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Contact
information

WORKSHOP OF PHOTONICS
Mokslininku st. 6A, Vilnius, LT-08412, Lithuania

Phone: +370 5 215 7551
E-mail: [email protected]

Company details

Altechna R&D, UAB
Company code 301502628
VAT code LT100006155012
Bank – SEB 70440
LT87 7044 0600 0770 8092

Contacts

Mokslininku st. 6A,
Vilnius LT-08412, Lithuania.
Phone: +370 5 215 7551
E-mail: [email protected]

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All Rights Reserved.
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