Unique laser technology for industrial glass, sapphire, and other brittle materials cutting, developed by WOP | Workshop of Photonics.
Based on WOP patented technology, it stands out for ultra-high precision and quality results, outperforming other glass cutting methods.
The demand for brittle materials industrial use continues to grow, raising new challenges and requirements for precision laser dicing. Addressing market needs Workshop of Photonics (WOP) developed a unique state-of-the-art glass and sapphire dicing technology to increase process yield and efficiency.
It offers ultra-high precision and quality on tempered glass, non-tempered glass, sapphire, and other brittle materials. Also small feature sizes, and high aspect ratios unachievable with alternative technologies.
|Glass thickness||2 – 19 mm||200 µm – 10 mm||30 µm – 2 mm||30 µm – 3 mm
|Glass type||All types||Non-tempered
|Cutting speed||up to 100 mm/s||Up to 300 mm/s||Up to 10 mm/s||Up to 800 mm/s|
|Possible shapes||Straight cuts only||T-shapes and circular shapes are possible||Any shape||Any shape possible|
|Surface chipping||< 200 µm||< 50 µm||< 50 µm||< 10 µm|
|Street requirement||> 50 µm||< 15 µm||> 50 µm||< 1 µm|
|Thermal effect on the device||yes||no||yes||no|
Rapid prototyping services to test your idea in an actual environment.
Ultra-high precision production services on all materials - glass, sapphire, ceramics, silicon, optical fibers, metal, plastic.
Tailor-made laser systems for industry & science. Designed for your specific applications.
Glass & sapphire cutting and dicing workstation for industry, that outperforms other glass cutting methods.
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