D236T glass laser cutting, thickness 300 µm
The demand for brittle materials industrial use continues to grow, raising new challenges and requirements for precision laser dicing. Addressing market needs Workshop of Photonics (WOP) developed a unique state-of-the-art glass and sapphire dicing technology to increase process yield and efficiency.
It offers ultra-high precision and quality on tempered glass, non-tempered glass, sapphire, and other brittle materials. Also small feature sizes, and high aspect ratios unachievable with alternative technologies.
Blade |
Stealth laser |
Laser ablation |
WOP Module |
|
| Glass thickness | 2 – 19 mm | 200 µm – 10 mm | 30 µm – 2 mm | 30 µm – 3 mm |
| Glass type | All types | Non-tempered Sapphire |
All types | Tempered Non-tempered Sapphire |
| Cutting speed | up to 100 mm/s | Up to 300 mm/s | Up to 10 mm/s | Up to 800 mm/s |
| Possible shapes | Straight cuts only | T-shapes and circular shapes are possible | Any shape | Any shape possible |
| Surface chipping | < 200 µm | < 50 µm | < 50 µm | < 10 µm |
| Street requirement | > 50 µm | < 15 µm | > 50 µm | < 1 µm |
| Water (cooling/cleaning) | yes | no | yes | no |
| Debris | yes | no | yes | no |
| Thermal effect on the device | yes | no | yes | no |
Integrated transparent material cutting module
Rapid prototyping services to test your idea in an actual environment.
Ultra-high precision production services on all materials - glass, sapphire, ceramics, silicon, optical fibers, metal, plastic.
Tailor-made laser systems for industry & science. Designed for your specific applications.
Glass & sapphire cutting and dicing workstation for industry, that outperforms other glass cutting methods.
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WORKSHOP OF PHOTONICS
Mokslininku st. 6A, Vilnius, LT-08412, Lithuania
Phone: +370 5 215 7551
E-mail: [email protected]
Altechna R&D, UAB
Company code 301502628
VAT code LT100006155012
Bank – SEB 70440
LT87 7044 0600 0770 8092
