For the glass becoming a demanding material, we offer exceptional expertise in glass processing.
Having more than ten years of intensive research in glass machining, we are confident – glass processing techniques are our major strength.
Our produced Glass Spacers (Interposers) are suitable for 2.5D / 3D integration and wafer-level bonding with semiconductor substrates for MEMS, sensors, analytical chips, or other functional devices.
WOP offers high surface quality glass wafers with densely packed through holes that require none or minimum post-processing before being used in your production process. We offer prototyping and production for your individual designs.
Workshop of Photonics processing technique enables not only wafer-level but individual components from glass and quartz production.
High accuracy and mechanical strength glass components, products for Wafer-level-packaging (WLP) can all be done according to your individual design.
Various mesh glass wafers and wafers for Wafer-level-packaging (WLP) can combine various shapes of through-holes with high aspect ratio channels in the same wafer.
WOP offers high surface quality glass wafers with densely packed features that require none or minimum post-processing before being used in your production process.
We offer prototyping and production for your individual designs.
Our ability to densely pack tens and hundreds of thousands of through holes in glass wafer allows us to offer price effective carrier wafers for convenient handling and release processes.
Depending on your needs we offer alkali and alkali-free perforated re-usable glass carriers which are custom made according to your design.
A straight cross-section of the hole enables us to combine more holes then are possible with other technologies and combine large through-holes with narrow channels at the same time.
Semiconductor industry further minimizing contact sizes and increasing density requires novel solutions to meet today’s market needs.
While conventional processing methods cannot keep up with feature size minimization at the same quality level, Workshop of Photonics is proposing glass components for probe cards industry (In-Line, Staggered, Area Array types of pads).