Glass Processing Services

For the glass becoming a demanding material, we offer exceptional expertise in glass processing.

Having more than ten years of intensive research in glass machining, we are confident – glass processing techniques are our major strength.

We ensure:

  • Ultra-high precision and quality
  • Various types of glasses
  • Small feature sizes
  • High aspect ratios unachievable with alternative technologies

Typical features

  • Variety of glasses, major suppliers – Corning, Schott, Hoya, AGC
  • Wafer size – up to 200 mm x 200 mm (8”)
  • Wafer thickness – from 30 µm to 10 mm
  • Round, square and other shapes through holes
  • Straight hole cross-section | no taper
  • ≤10 μm chipping > typ. none
  • Smooth sidewalls, Ra<1 μm
  • Typical min. hole size 20 µm (round)
  • ±3 µm positional accuracy
  • No debris on back and front surface
  • No sagging around holes
  • Aspect ratio up to 1:100
  • High throughput and yield
  • Ability to work with metalized glasses (e.g. Au, Pt, Ni, Cr, Mo)
  • Minimal or no post-processing is needed

Applications

  • Sensors
  • Advanced packaging applications
  • Semiconductors
    and other functional devices
  • MEMS
  • Wafer level optics
  • Aerospace applications

Glass spacers | Interposers

Our produced Glass Spacers (Interposers) are suitable for 2.5D / 3D integration and wafer-level bonding with semiconductor substrates for MEMS, sensors, analytical chips, or other functional devices.

WOP offers high surface quality glass wafers with densely packed through holes that require none or minimum post-processing before being used in your production process. We offer prototyping and production for your individual designs.

Packaging glass products

Workshop of Photonics processing technique enables not only wafer-level but individual components from glass and quartz production.

High accuracy and mechanical strength glass components, products for Wafer-level-packaging (WLP) can all be done according to your individual design.

Micro drilled glass

Various mesh glass wafers and wafers for Wafer-level-packaging (WLP) can combine various shapes of through-holes with high aspect ratio channels in the same wafer.

WOP offers high surface quality glass wafers with densely packed features that require none or minimum post-processing before being used in your production process.
We offer prototyping and production for your individual designs.

Glass carrier wafers

Our ability to densely pack tens and hundreds of thousands of through holes in glass wafer allows us to offer price effective carrier wafers for convenient handling and release processes.

Depending on your needs we offer alkali and alkali-free perforated re-usable glass carriers which are custom made according to your design.

A straight cross-section of the hole enables us to combine more holes then are possible with other technologies and combine large through-holes with narrow channels at the same time.

Glass cards for the parallel arrangement of probes

Semiconductor industry further minimizing contact sizes and increasing density requires novel solutions to meet today’s market needs.

While conventional processing methods cannot keep up with feature size minimization at the same quality level, Workshop of Photonics is proposing glass components for probe cards industry (In-Line, Staggered, Area Array types of pads).

Glass cutting

We ensure ultra-high precision and quality on tempered and non-tempered glasses, small feature sizes, and high aspect ratios unachievable with alternative technologies.

We can work with all glass grades, including chemically tempered glass or optically coated glass.

Being said that, we have mechanical dicing tools that extend our capabilities and let us offer solutions to all markets.

 

Contact now

 

Features

  • Straight or irregular cuts
  • <20 μm chipping (typ. none)
  • Smooth side walls (Ra<1 μm)
  • Ability to cut from 30 µm to 10 mm thick glass
  • No debris on back and front surface
  • High throughput and yield
  • High bending strength (up to 180 MPa)
  • Easy adaptation for different glass types (Borofloat 33, Eagle XG, D263T, SD2, SW-Y, Gorilla, AS87, etc.) or fused silica
  • Ability to cut non-glass materials (Available)
  • Mechanical glass cutting (Available)
  • Ability to work with metalized and optically coated glasses
  • Minimal or no post-processing is needed
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Contact
information

WORKSHOP OF PHOTONICS
Mokslininku st. 6A, Vilnius, LT-08412, Lithuania

Phone: +370 5 215 7551
E-mail: [email protected]

Company details

Altechna R&D, UAB
Company code 301502628
VAT code LT100006155012
Bank – SEB 70440
LT87 7044 0600 0770 8092