The sub-micron era is here, and the projections show that the need will only increase for wafers, glass, ceramics, and metal parts with micron and sub-micron-level features on them.
Such parts could be readily assembled into multi-layered chips or devices but still require some dicing.
There are a few different methods to dice materials – we are comparing them in the PhotonicsViews article, explaining why and when femtosecond laser micromachining is a choice for you while looking for that ultra-smooth cut.
Read the full article here: https://onlinelibrary.wiley.com/doi/epdf/10.1002/phvs.202300033
This years decoration – glass snowflake – is made in our lab, and the ornaments…
Let’s meet live at the exhibitions: Semicon Taiwan, ECOC Frankfurt, LWOP India, Compamed Dusseldorf, and…
As a result, a distinct application of polarization singularities in laser micro processing was demonstrated…
