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06 September, 2023
The Future of Dicing is Here: High-Precision Processing of Transparent Materials for Various Applications

The sub-micron era is here, and the projections show that the need will only increase for wafers, glass, ceramics, and metal parts with micron and sub-micron-level features on them.

Such parts could be readily assembled into multi-layered chips or devices but still require some dicing.

There are a few different methods to dice materials Рwe are comparing them in the PhotonicsViews article, explaining why and when femtosecond laser micromachining is a choice for you while looking for that ultra-smooth cut.

Read the full article here: https://onlinelibrary.wiley.com/doi/epdf/10.1002/phvs.202300033

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