The sub-micron era is here, and the projections show that the need will only increase for wafers, glass, ceramics, and metal parts with micron and sub-micron-level features on them.
Such parts could be readily assembled into multi-layered chips or devices but still require some dicing.
There are a few different methods to dice materials – we are comparing them in the PhotonicsViews article, explaining why and when femtosecond laser micromachining is a choice for you while looking for that ultra-smooth cut.
Read the full article here: https://onlinelibrary.wiley.com/doi/epdf/10.1002/phvs.202300033
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