Christoph Wunderling and Stefanie Tertelmann examine the impact of a 1950 nm femtosecond laser on micromachining. The article named “Advanced Processing Using A 1950 nm Femtosecond Laser” was published in The Laser User issue, Spring 2023.
In this article, the processing possibilities of silicon using an InnoLas Photonics femtosecond laser with a wavelength of 1950 nm are presented, and two exemplary applications are shown – the modification inside silicon and the selective laser-induced etching of fused silica(1).
The actual experiments were held at WOP | Workshop of Photonics laboratory.
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Material processing is still a challenging task. For example, established lasers with wavelengths around 1 μm are suitable for processing silicon due to the high absorption at this
wavelength, but mainly on the surface. The absorption coefficient is a limiting value when processing silicon inside or on the backside is necessary (1).
In conclusion, the study shows that femtosecond lasers emitting a wavelength of around 2000 nm can extend the possibilities of laser manufacturing for high-end materials.
Read the full article Learn more about silicon micromachining(1) Wunderling Ch.,Tertelmann S. Advanced Processing Using A 1950 nm Femtosecond Laser, The Laser User, Spring issue 2023.
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