WOP Introduces The Highest Quality Through Glass Vias (TGVs) in The Market

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WOP Introduces The Highest Quality Through Glass Vias (TGVs) in The Market

18 July, 2025

As a result of its long-term expertise in glass micromachining, WOP is now able to offer the highest quality vias on the market, featuring 100% yield and repeatability.

As high-performance semiconductors advance, packaging has become crucial – especially the interposer, which connects multiple dies within a package.

While silicon has traditionally been used, glass is emerging as a promising alternative due to several key advantages:

Electrical Performance. Glass offers superior insulation, a lower dielectric constant, and minimal leakage current, reducing signal loss and crosstalk at high data rates—ideal for AI and HPC applications.
Surface Quality. Its ultra-smooth and uniform surface allows for precise, dense routing with tight pitch, supporting advanced packaging needs.
Scalability. Unlike silicon, glass can be processed on large panels, enabling larger and more cost-effective interposers for packages with bigger die footprints and more HBM stacks.
Thermal Compatibility. Glass’s coefficient of thermal expansion closely matches silicon, improving mechanical reliability during temperature changes.

However, the most immediate demand is for glass interposers, which face intense bandwidth, signal quality, and size requirements. As a result, glass interposer development is advancing more rapidly than glass core substrates, although both areas are being actively explored.

Laser Technology for TGV

The most used method for glass core substrate processing while creating TGVs is laser fabrication, combined with a wet etch process. Once the TGVs are fabricated, they are filled with copper to provide electrical connections between the front and back of the glass panel substrate.

Regardless of the glass fabrication process is known, there are still many challenges to address, such as the hole size, roundness, X/Y location, sidewall profile, defective vias, fabrication speed, and other factors that are critical to package performance and cost. The level of expertise and knowledge in glass micromachining is crucial in overcoming these challenges.

Learn more about TGV

WOP has been dedicated to mastering the laser micromachining of glass substrates for over a decade and has developed process technologies and equipment that are suitable for high aspect ratio through glass vias across a variety of glass types, diverse via configurations (including hourglass, straight, and tapered vias), and different etching capabilities by utilizing various chemistries.

WOP Advancements in TGV

WOP’s journey with TGV began in 2017, and over the years, we have accumulated fundamental knowledge through extensive experimentation.

As a result of this long-term expertise in glass micromachining, WOP is now able to offer the highest quality vias in the market today, featuring a 100% yield and repeatability.

WOP TGVs parameters:

Roundness: >95%
Waist: Borosilicate >90%, Alkali-free >75% (with deviation of ±3%)
Diameter tolerance: ± 3%
Accuracy: ±1 µ m (<5 µm per 515×510 mm panel)
Roughness: Rz <1 µm
Yield: 100%
Taper: taperless, hourglass

Download TGV brochure

WOP TGV Results | Single Shot

BF33, 0.7 mm, top view

BF33, 0.7 mm, cross-section

EXG, 0.9 mm, cross-section

EXG, 0.9 mm, top view

D263, 0.9 mm, D image

Fused silica, 0.5 mm, bottom view, illuminated

WOP Current State of The Art in TGVs

While both multi-shot and single-shot methods can be employed, each has its advantages.

Multi-shot methods provide better control and facilitate the creation of high aspect ratio TGVs, while single-shot methods are significantly faster but may face limitations in other specifications.

FemtoTGV Laser System

WOP offers prototyping, contract manufacturing and laser system development services for Through Glass Via’s | TGVs.

FemtoTGV is a laser micromachining workstation optimized for Through Glass Vias (TGV) fabrication.

The most used method for glass core substrate processing while creating TGVs is laser fabrication, combined with a wet etch process. Our FemtoTGV is dedicated for laser fabrication part.

WOP has been dedicated to mastering the laser micromachining of glass substrates for over a decade.

And has developed process technologies and equipment that are suitable for high aspect ratio through glass vias across a variety of glass types, diverse via configurations (including hourglass, straight, and tapered vias), and different etching capabilities by utilizing various chemistries.

More about FemtoTGV

Contact us for more information about our TGV technology!

Download TGV brochure