Laser Micromachining Software SCA

  • Laser micromachining software SCA engineer
  • Laser micromachining software SCA. Find object - circle detection
  • Laser micromachining software SCA. Corner detection
  • Laser micromachining software SCA. Cross and grid detection

Laser micromachining software SCA is developed for control and automation of laser micromachining systems. SCA provides speed, flexibility and visibility to laser micromachining operations. It controlls laser source, positioning stages, galvanometric scanners and various peripheral devices synchronously, It enables to perform various 2D and 3D laser machining tasks based on graphic files without any machine code generation.

Laser micromachining software SCA is essential part of laser systems and is not sold separately.

Laser micromachining software SCA is distinguished among other existing laser software solutions by the key working principle. It controls hardware by directly addressing its command libraries (no machine code conversion is used). SCA software controls a long list of various hardware devices, renging from positioning stages to scanners and from laser sources to power meters. Additional hardware support may be provided on request or implemented by user by creating plugins.

Key benefits of the software:
  • Eliminated need to work with G-code
  • WYSIWYG interface
  • Convenient input of fabrication algorithms and mathematical commands
  • Direct control of hardware: laser, positioning stages, galvanometric scanners,
    power attenuators and power meters, polarization rotators, machine vision and
    other dedicated peripheral devices
Laser micromachining software SCA features:
  • DXF, PLT, STL, BMP, SVG, AI file format import
  • Import of data from TXT or XML files
  • Slicing and hatching of 3D object for 2.5D fabrication
  • Digital and analog I/O control
  • Fabrication preview window
  • Camera view in superposition with fabrication preview
  • Machine vision (MV) module for sample position detection

Recommended system requirements:
  • WinXP/Win 7 operating system
  • Equivalent to ATI Radeon HD 2000 series, NVIDIA GeForce 210 (or better)
  • Double core 2 GHz CPU (or better)
  • 2 GB of RAM (or better)
Supported file formats:
  • .dxf – for 3D and 2D object fabrication
  • .plt (.hpgl, .hpg) – standart plotter format for fabrication of 2D objects; features fabrication trajectory optimization, hatching function with varying line density and angle
  • .stl – file format standard used in 3D lithography; features horizontal and angled slicing, shell formation according to surface of an object, shells (or layers) can vary in numbers, distance between shells. User can define number of inside and outside shells to be modelled and distance between shells. This allows increasing wall thickness of a fabricated 3D object
  • .bmp– common raster graphics file format, featuring gray scale fabrication based on pulse density, relief fabrication based on bitmap intensity levels, polarization change based on bitmap intensity levels

  1. T. Kildušis, T. Kazakevičius, “SOFTWARE & COMPUTING: Laser micromachining software attains research-friendly status“, Laser Focus World, Vol. 47, Issue 11, (2011).
  2. D. Paipulas et al. “Volumetric modifications in fused silica using Gaussian and Bessel femtosecond laser beams”, Proc. SPIE 8786, Pacific Rim Laser Damage 2013: Optical Materials for High Power Lasers, 87860D ( 2013). doi: 10.1117/12.2020258
  3. E. Jelmakas et al. “A systematic study of light extraction efficiency enhancement depended on sapphire flipside surface patterning by femtosecond laser”,  Journal of Physics D: Applied Physics, Volume 48, Number 28, (2015). doi: 
  4. S. Butkus, A. Alesenkov et al. “Analysis of the Micromachining Process of Dielectric and Metallic Substrates Immersed in Water with Femtosecond Pulses”, Micromachines 2015, 6(12), 2010-2022, (2015). doi: 10.3390/mi6121471
  5. V. Sabonis et al. “Wetting Properties Modification of TiO2 Layer by Femtosecond UV Pulses”, JLMN-Journal of Laser Micro/Nanoengineering Vol. 10, No. 1, (2015). doi: 10.2961/jlmn.2015.01.0005
  6. S. Butkus et al. “Micromachining of Transparent, Semiconducting and Metallic Substrates Using Femtosecond Laser Beams”, JLMN-Journal of Laser Micro/Nanoengineering Vol. 11, No. 1, (2016). doi: 10.2961/jlmn.2016.01.0015 
  7. V. Stankevič et al. “Internal to External Microfluidic Device for Ellipsometric Biosensor Application”, JLMN-Journal of Laser Micro/Nanoengineering Vol. 11, No. 1, (2016). doi:  10.2961/jlmn.2016.01.0010
  8. X. W. Wang, R. Buividas, F. Funabiki et al. “Analysis of defects patterned by femtosecond pulses inside KBr and SiO2 glass”,  Appl. Phys. A  122: 194 (2016). doi:10.1007/s00339-016-9647-0
  9. B. Sotillo, V. Bharadwaj, J. P. Hadden , et al. “Diamond photonics platform enabled by femtosecond laser writing”, Scientific Reports 6, Article number: 35566 (2016). doi:10.1038/srep35566
  10. T. Tamulevičius, L. Šimatonis, O. Ulčinas, S. Tamulevičius, E. Žukauskas, R. Rekuvienė, L. Mažeika et al. “Micromachining and validation of the scanning acoustic microscope spatial resolution and sensitivity calibration block for 20–230 MHz frequency range”, Microscopy (Oxf) Volume 65 (5), 429-437 (2016). doi:

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