Optical Elements Machining Services

Cutting & Dicing

We offer precision cutting and dicing services on customer-supplied materials.

Our equipment includes DAD3350 machine, which ensures excellent results on hard and brittle materials such as glass, silicon, and ceramics.

• High tolerances.
• Sizes: from 7 x 7 mm to 140 x 140 mm.
• Express service.

Grinding

WOP can grind both – flat substrates and cylindrical substrates to create a uniform surface for further manufacturing techniques.

• Material – precision glass, sapphire, ceramic, IR materials.
• Possible diameters – from 5 x 5 mm to 100 x 100 mm.
• Parallelism up to 3 arcmins.

Thickness Reduction

Available for elements from 5mm to 150 mm thick.

Coated surface protection.