Laser micro scribing is a laser micromachining process often used within the semiconductor industry for semiconductor wafers production.
During the laser scribing process, the laser beam does not go entirely through the material – a laser beam goes across a substrate to produce a series of blind cuts or scribe lines that are easy and clean to break out.
The scribing technique has the benefit of speed – it is a lot faster process than laser cutting.
Laser scribing is applicable to diverse materials like glass, sapphire, silicon, ceramics.
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