Glass Cards for The Parallel Arrangement of Probes

The semiconductor industry further minimizing contact sizes and increasing density requires novel solutions to meet today’s market needs.

While conventional processing methods cannot keep up with feature size minimization at the same quality level, we are proposing glass components for probe cards industry (In-Line, Staggered, Area Array types of pads).

We ensure:

  • Ultra-high precision and quality
  • Various types of glasses
  • Small feature sizes
  • High aspect ratios unachievable with alternative technologies

Typical features

  • Variety of glasses, major suppliers – Corning, Schott, Hoya, AGC
  • Wafer size – up to 200 mm x 200 mm (8”)
  • Wafer thickness – from 30 µm to 10 mm
  • Round, square and other shapes through holes
  • Straight hole cross-section | no taper
  • ≤10 μm chipping > typ. none
  • Smooth sidewalls, Ra<1 μm
  • Typical min. hole size 20 µm (round)
  • ±3 µm positional accuracy
  • No debris on back and front surface
  • No sagging around holes
  • Aspect ratio up to 1:100
  • High throughput and yield
  • Ability to work with metalized glasses (e.g. Au, Pt, Ni, Cr, Mo)
  • Minimal or no post-processing is needed

Applications

  • Sensors
  • Advanced packaging applications
  • Semiconductors
    and other functional devices
  • MEMS
  • Wafer level optics
  • Aerospace applications
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Contact
information

WORKSHOP OF PHOTONICS
Mokslininku st. 6A, Vilnius, LT-08412, Lithuania

Phone: +370 5 215 7551
E-mail: [email protected]

Company details

Altechna R&D, UAB
Company code 301502628
VAT code LT100006155012
Bank – SEB 70440
LT87 7044 0600 0770 8092