Laser Scribing

Laser micro scribing is a laser micromachining process often used within the semiconductor industry for semiconductor wafers production.

During the laser scribing process, the laser beam does not go entirely through the material – a laser beam goes across a substrate to produce a series of blind cuts or scribe lines that are easy and clean to break out.

The scribing technique has the benefit of speed – it is a lot faster process than laser cutting.

Laser scribing is applicable to diverse materials like glass, sapphire, silicon, ceramics.