Laser Technology for Cutting Glass and Sapphire

  • Laser technology for cutting glass and sapphire. Optical module
  • Laser technology for cutting glass and sapphire. Optical module on Pharos
  • Patent pending laser technology for cutting glass and sapphire
  • Laser technology for cutting glass and sapphire
  • Laser technology for cutting glass and sapphire - samples
  • Laser technology for cutting glass and sapphire - samples

Workshop of Photonics has developed a break through transparent material cutting technology, which enables scribing tempered, non-tempered glass and sapphire in straight or curved lines. The main advantages of technology are high speed and cutting quality, which makes it attractive for consumer electronics industry.

Laser technology for cutting glass and sapphire developed by Workshop of Photonics is currently patent pending. Optical module and technology licence are available for purchase. Suitable laser source may be delivered together.

Laser technology for cutting glass and sapphire specifications:
  • Scribing tempered, non-tempered glass and sapphire
  • Irregular shape cutting
  • High process speed ≥ 200 mm/s
  • High throughput and yield
  • Low chipping <5 μm for most materials
  • Easy breaking for non-tempered glass and self breaking for tempered glass
  • Smooth side walls after breaking, Ra<1 μm
  • No debris on back and front surface
  • Single pass process for glass up to 1 mm thickness
  • Already tested with strengthened glass from 0.3 mm to 1.3 mm thickness
  • DOL layer from 10 μm to > 80 μm.
  • High bending strength
  • Easy adaptation for different glass types

Glass cutting module specifications:
  • Optimized for 1028 nm wavelength
  • Sealed monolithic housing
  • Integrated autofocus (AF) unit with 400 μm piezo axis for sample tilt compensation
  • Integrated motorized linear axis with 15 mm travel, optional, eliminates the need of external Z axis
  • External Machine vision unit  available on request (not visible in picture below)
  • Optional alignment module for adjustment
  • Dimensions HxWxD: 315x369x102 mm

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  1. Detachable alignment unit (DAU) – for adjustment and for servicing procedures (alignment check).
  2. External Machine vision module. Includes objective (from 1.5x magnification) with coaxial light source.
  3. Piezo stage (with 400 μm travel range) for autofocus and motorized internal linear Z stage (with 15 mm travel range) for adjustment between different glass thickness.

For system integrators Workshop of Photonics offers easy to implement packages:

  • Optical module and technology licence
  • Optical module, technology licence and suitable laser source

Standalone module mounting can be seen in the picture bellow.

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If you are interested in our product or have questions – feel free to contact us via contact form below: 

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