Markets

  • Tempered Glass Laser Cutting

    • Cutting speed from 200 mm/s
    • Easy to break after processing
    • No post-processing needed

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  • Surface Structuring

    • Controlled period and aspect ratio of the ripples
    • Applicable for SERS
    • Up to 200 nm ripple period


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  • Stent Cutting and Drilling

    • Various polymer stents
    • Precise control of taper angle and diameter of holes in stents
    • No melting or burning effects


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  • Steel Foil Micro-Drilling

    • High speed laser processing
    • No melting
    • Holes diameter in micrometer range

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  • Selective Metal Ablation

    • Ablation from various surfaces
    • High accuracy
    • Precise control of geometry and depth of the ablated area


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  • Sapphire Surface Texturing

    • Micron resolution
    • Large area processing
    • Single pulses used to form craters on the surface of sapphire


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  • Sapphire Laser Cutting

    • Cutting speed from 200 mm/s
    • Easy to break after processing
    • No post-processing needed

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  • Ruby Drilling

    • Precise control of hole geometry, diameter and taper angle
    • High processing speed
    • No cracks or burning effects


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  • Micro-Holes Drilling in Metals

    • Material: special steel (e.g. used for fuel nozzles), other
    • Precise control of taper angle
    • Variable geometry


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