Selective Laser Ablation of Hard Materials

  • Selective Laser Ablation of Hard Materials PCD-crater
    Bottom of structure in PCD
    Bright field illumination
  • Selective Laser Ablation of Hard Materials PCD-crater-2
    Top edge of structure in PCD
    Bright field illumination
  • Selective Laser Ablation of Hard Materials 3mmx50
    Texturized sapphire surface
  • Selective Laser Ablation of Hard Materials Skyles-safyre
    Ablated areas on sapphire
  • Selective Laser Ablation of Hard Materials 94
    Square ablated on sapphire
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Selective laser ablation today is the most common industrial application of the lasers, because of high processing speed and high quality of processed area. However, hard material ablation (e.g.  polycrystalline diamond (PCD) and sapphire) is a challenging task even for lasers. Except femtoecond lasers. Femtosecond laser pulses allows to bypass not only the hardness of materials, but also very high thermal conductivity which may lead to burned regions if other methods are used.

Selective laser ablation of hard materials features:
  • High speed laser processing
  • No signs of burning
  • No heat affected zones
  • High positioning accuracy
  • High quality
  • Micron resolution
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