Markets

  • Tempered Glass Laser Cutting

    • Cutting speed from 200 mm/s
    • Easy to break after processing
    • No post-processing needed

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  • Surface Structuring

    • Controlled period and aspect ratio of the ripples
    • Applicable for SERS
    • Up to 200 nm ripple period


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  • Stent Cutting and Drilling

    • Various polymer stents
    • Precise control of taper angle and diameter of holes in stents
    • No melting or burning effects


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  • Steel Foil Micro-Drilling

    • High speed laser processing
    • No melting
    • Holes diameter in micrometer range

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  • Selective Metal Ablation

    • Ablation from various surfaces
    • High accuracy
    • Precise control of geometry and depth of the ablated area


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  • Sapphire Surface Texturing

    • Micron resolution
    • Large area processing
    • Single pulses used to form craters on the surface of sapphire


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  • Sapphire Laser Cutting

    • Cutting speed from 200 mm/s
    • Easy to break after processing
    • No post-processing needed

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  • Ruby Drilling

    • Precise control of hole geometry, diameter and taper angle
    • High processing speed
    • No cracks or burning effects


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  • Micro-Holes Drilling in Metals

    • Material: special steel (e.g. used for fuel nozzles), other
    • Precise control of taper angle
    • Variable geometry


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  • Micro Optics on Optical Fiber

    • Matching refractive index
    • Shape flexibility
    • Resolution from 100 nm to 20 μm

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  • Metal Surface Texturing

    • Materials: cast iron, other
    • Metal surface texturing with micron scale holes and grooves
    • Minimum heat affected zone


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  • Metal Surface Structuring

    • Materials: steel, cast iron, other
    • 3D structures formed
    • High precision and smoothness of the surface achieved


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  • Marking of Solar Cells

    • No melting, burning effects, or cracking near markings
    • High speed processing
    • High positioning accuracy


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  • Laser Marking of Metals

    • High contrast and durability
    • Colourful structures available
    • No melting, burning effects, or cracking near markings


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  • Laser Marking Inside Fiber

    • No impact on fiber strength
    • No surface damage
    • Even light dispersion

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  • Laser Edge Isolation

    • Precise control of geometry and depth of the ablated area
    • Micron resolution
    • High positioning accuracy


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  • In-Volume Structuring

    • Colorful structures
    • Surface not affected
    • High positioning accuracy and resolution (3D marking available)


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  • Glass Surface Marking

    • Data inscribed on a glass surface
    • No heat affected zone
    • Extremely small individual elements, up to 5 μm in size


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  • Glass Micro-Drilling

    • High quality
    • Controlled geometry of hole
    • Precise control of taper angle and diameter of holes in glass


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  • Fiber For Light Scattering

    • No impact on fiber strength
    • No surface damage
    • Even light dispersion

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  • Drilling of Optical Fiber

    • Diameter from <10 μm
    • Various hole profiles possible
    • Control of depth and taper angle

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  • Drilling of Glass Needles

    • Precise control of taper angle and diameter of holes
    • No debris and no cracking
    • High speed processing


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  • Dielectric Layers Ablation

    • Forming openings for electrode bus bars and electrode fingers
    • Precise ablation of upper layer
    • No harm for emitter layer


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  • Contacts for Solar Cells

    • Front and back contact formation
    • High speed processing
    • Precise control of contact diameter formed on the solar cell


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  • Contact Lens Volume Marking

    • Surface not affected
    • High positioning accuracy and resolution (3D marking available)
    • No heat affected zones


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  • Bragg Gratings

    • Diffraction efficiency up to 99%
    • Up to 1000 lines/mm
    • Refractive index modulation of up to 0.003


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  • Ablation of PCD

    • No melting, burning effects, or crackings near ablated area
    • Precise control of depth and geometry
    • Micron resolution


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